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Refurbished and Repaired Alternative Disco Zhrf Diamond Slitting Saw, Specialized for Wafer Cutting
US$500.00-5,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
One Year Free WarrantyWarranty
One Year Free WarrantyModel NO.
ZHRFUsage
Cutting Semiconductor WafersKeyword1
Oxide Wafer Cutting BladeKeyword2
Cutting Silicon WafersKeyword3
Diamond Hard KnifeKeyword4
Wafer Dicing BladeTransport Package
Wooden Case Packing, Sea and Air Freight Are AvailTrademark
Taiyuan Machinery (Dongguan) Co., LtdOrigin
Dongguan City, Guangdong Province, ChinaProduction Capacity
500PCS/MonthKey features
Enhanced Blade Strength: Improved rigidity prevents oblique and wavy cutting, ensuring stable processing under high loads.
High Precision Cutting: Uses ultra-fine diamond micropowder and aluminum alloy substrate for narrow grooves and minimal chipping.
Versatile Application: Specialized for cutting silicon wafers, oxide wafers, and low-dielectric-constant layers with high-speed handling.
One Year Warranty: Includes one year free warranty for after-sales service and quality assurance.
Compatible with Laser Grooving: Supports high-speed wafer cutting after laser grooving and processes requiring large-area leaf exposure.
Customization Options: Offers customization from samples, designs, full customization, minor customization, and flexible customization.
Wide Model Range: Supply and sales of DISCO ZHZZ series models including ZHZZ-SD4000, ZHZZ-SD4800, and ZHZZ-SD3000.
Comprehensive Spare Parts: Long-term supply of original and refurbished DISCO spare parts, consumables, and repair services.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen Port, Guangzhou PortAverage Response Time: ≤1.40h
About Our Factory & Business Background
Address103 Room, No. 28 Huancheng Dong Road, Dongcheng Street, Dongguan, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 1-3 months Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners15
Our Production Capability & Technical Expertise
Main ProductsThe Experiment Machine, Mixing Equipment, Double Column Hydraulic Press, Centrifugal Pump, Video Measuring System, Hardness Tester
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2020-07-02
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice80%~100%
Number of Foreign Trading Staff2
Overseas Agent/BranchYes
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this product?
A:
We provide a one-year free warranty for after-sales service.
Q:What materials can this diamond slitting saw cut?
A:
It is specialized for cutting semiconductor wafers, including silicon wafers and oxide wafers.
Q:Does this product support customization?
A:
Yes, we offer customization from samples, designs, full customization, minor customization, and flexible customization.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, D/P, PayPal, Western Union, and small-amount payment.
Send Inquiry
*To:
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd*Content:
Supplier replies will be sent to your registered email
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