UV Laser Technology: 355nm wavelength with photochemical ablation for ultra-fine marking on nonmetals.
High Precision Marking: Minimum spot size reaches 10UM with negligible heat affected zone.
Fast Marking Speed: Processing speed up to 12000mm/s for high-efficiency production lines.
Long Service Life: Laser gain source offers over 20,000 to 30,000 hours of operation.
Versatile Applications: Suitable for food packaging, glass division, silicon wafers, and micro holes.
Flexible Power Upgrade: Update power without changing the entire system for future needs.
Durable Construction: All aluminum structure with sandblasting oxidation for stability.
Water Cooling System: Efficient water cooling ensures stable performance during operation.