UV Laser Technology: 355nm wavelength with photochemical ablation for ultra-fine marking on nonmetals.
High Precision Marking: Minimum spot size reaches 10UM with negligible heat affected zone.
Fast Marking Speed: Marking speed up to 12000mm/s for efficient production lines.
Long Service Life: Laser gain life exceeds 20,000 to 30,000 hours.
Versatile Applications: Suitable for food, pharmaceutical, glass, and silicon wafer marking.
Flexible Power Options: Available in 3W, 5W, 10W, and 15W configurations for various needs.
Durable Construction: All aluminum structure with sandblasting oxidation treatment.
Comprehensive Support: 1-year warranty with 24/7 technical support via multiple channels.