104GSM Electronic Fiberglass Cloth Insulation for Copper-Clad Laminates

Fully dispersed fibers: Electronic Fiberglass Fabric uses high-pressure water opening to split fiber bundles, ensuring uniform fiber distribution for consistent reinforcement.

Ultimate insulation with zero conductive risk: Electronic Fiberglass Fabric is alkali-free glass (alkali metal <0.8%), non-conductive with high breakdown voltage, serving as core PCB insulation.

Special silane sizing for strong resin bonding: Electronic Fiberglass Fabric uses amino and low-loss silane coupling agents, ensuring strong fiber-resin adhesion and high peel strength.

Uniform resin impregnation: Electronic Fiberglass Fabric enables full resin penetration, producing bubble-free, delamination-free substrates for high-quality PCB manufacturing.

Both smooth selvedge and rough edge available: Electronic Fiberglass Fabric supports two edge types: smooth selvedge or rough edge, allowing clients to choose as required.

High dimensional precision & superior flatness: Electronic Fiberglass Fabric features micron-level tolerances for density and thickness, with a uniform surface free of coarse filaments or uneven mesh.

Wide range of applications: Electronic Fiberglass Fabric is widely applied to coated fabrics, FR4 sheets, PCBs and CCL copper clad laminates for various electronic industries.

Stable raw material supply: We own independent glass melting furnaces, which ensure consistent raw material quality forElectronic Fiberglass Fabric with stable batch performance.

Heavy-duty protective packaging: Electronic Fiberglass Fabric is packed in thick long cartons with fumigation-free pallets, resisting extrusion and bending to keep rolls undeformed in transit.

Extremely flat fabric surface: Woven with constant tension, the whole roll of Electronic Fiberglass Fabric has uniform thickness, few joints and defects, free of waves, bulges or uneven mesh.