What is the minimum order quantity?

The Minimum Order Quantity (MOQ) is 1 PCS.

What are the lead times for production?

Peak season lead time is one month, while off-season lead time is within 15 workdays.

Does the machine support OEM/ODM customization?

Yes, OEM and ODM services are available, including customization from samples, designs, and full customization.

Laboratory Chip Bond Tester with Advanced Thrust Testing Module

Name: Laboratory Chip Bond Tester with Advanced Thrust Testing Module
Brand: Dongguan Weibang Instrument Equipment Co., Ltd.
SKU: 2255358735

Guangdong, ChinaDongguan Weibang Instrument Equipment Co., Ltd.

US$7,999.00-40,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Online Technical Support

Warranty

2 Year After-Sales Service

Model NO.

WBE-9088B

Max Diameter of Workpiece

<500mm

Type

Thrust Testing Machine

Maxcapacity

<1000KN

Accuracy Grade

0.1

Load Way

Mechanical Load

Loading Method

Static Load

Display

Digital

Control

Manual Control

Weight

100g-100kg

Power Source

AC220V

Tensile Testing Range

100g to 20kg

Thrust Testing Range

250g to 100kg

Module Switching

Auto Rotation Module

X-Axis/Y-Axis

Effective Stroke 100-500mm,Resolution 0.1μm

Z-Axis Testing Min Positioning Height

<=1μm

Transport Package

Woden Box

Specification

Customized service

Trademark

WBE

Origin

Guandong, China

Production Capacity

500set/Moth

Key features

High Precision Testing: 0.1% accuracy grade with imported precision sensors and 7-step automatic shift function.

Multi-Function Versatility: Performs chip thrust, gold wire tensile, golden ball thrust, and BGA matrix tests.

Advanced Control System: Three closed loops for load, displacement, and speed with 32-bit high-resolution AD converter.

Customizable Ranges: Tensile range 100g-20kg and thrust range 250g-100kg are customizable to specific needs.

Comprehensive Data Analysis: Displays waveform charts, histograms, and detailed reports via intuitive computer interface.

Robust Safety Features: Each sensor has independent anti-collision overload protection to prevent precision deviations.

Compact Design: Dimensions 430x665x790mm, weighing 95KG, suitable for various workspace integrations.

Company profile

High Repeat Buyers ChoiceCooperated with Fortune 500Patents AwardedQuality Assurance

Dongguan Weibang Instrument Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 14 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤18h

AI-Powered supplier vetting

SummaryDongguan Weibang Instrument Equipment Co., Ltd. is a China-based combined company established in 2011 with 60 employees. The supplier demonstrates broad customization, 3D design, ODM, and OEM capabilities, supported by recent product development and documented R&D processes. Manufacturing-related evidence includes raw-material traceability, 100% finished-product inspection, three QA/QC inspectors, and facilities for laser cutting, bending, milling, and welding. It has written procedures for supplier-service assessment, corrective and preventive actions, and customer complaints. However, the provided information does not identify certifications, customer cases, or overseas service infrastructure. The supplier has no overseas warehouse, showroom, agents, or branches, and has not participated in offline trade shows. Financial credibility cannot be determined from the available non-financial evidence.

Supplier typeThe supplier is identified as Dongguan Weibang Instrument Equipment Co., Ltd., a limited company in Dongguan, Guangdong, China, and is classified as a combined company. The profile describes manufacturing, export trade, service, quality control, R&D, and sustainable-development capabilities.

After-Sales capabilityTechnology engineers provide technical support for production and after-sales service. The supplier also reports written and followed procedures for customer complaints and corrective/preventive actions, supporting a defined after-sales management process.

R&D capabilityThe supplier reports new products within the past year, engineers responsible for new product development, available R&D audit documentation covering design inputs, outputs, reviews, verification, and validation, and ODM service capability. It does not have an available SDK, but that limitation does not negate the broader documented R&D evidence.

Production capacityProduction evidence includes laser cutting, bending, milling, and welding facilities, raw-material traceability, 100% finished-product inspection, three QA/QC inspectors, inventory capability, and valid manufacturing contracts with associated subcontractors. Peak-season lead time is stated as one month and off-season lead time as within 15 working days.

Customization capabilityThe supplier explicitly supports customization from samples, designs, full customization, minor customization, and flexible customization. It also provides 3D software design services and ODM services, indicating broad product-design and customization support.

Product Q&A

Q:What types of tests can this Bond Tester perform?

It performs internal lead pull tests, micro solder joint thrust evaluations, golden ball thrust tests, chip shear force assessments, SMT component thrust tests, and BGA matrix thrust analyses.

Q:Is the testing range customizable?

Yes, the tensile testing range (100g to 20kg) and thrust testing range (250g to 100kg) can be customized to meet specific requirements.

Q:What is the accuracy grade of the machine?

The machine features an accuracy grade of 0.1, ensuring unparalleled accuracy and stability in every evaluation.

Q:What after-sales service is provided?

We provide online technical support, a 2-year warranty, installation/debugging, technical guidance, spare parts supply, and maintenance services.

Q:What are the main applications for this equipment?

It is suited for semiconductor, LED, smart card packaging, communication, automotive electronics sectors, and research institutions for failure analysis.