Customizable Testing Ranges: Offers flexible tensile (100g-20kg) and thrust (250g-100kg) ranges tailored to specific needs.
Advanced Four-Axis Platform: Features imported transmission components for superior speed, stability, and 360-degree rotation.
Comprehensive Software Suite: Supports waveform charts, histograms, and data reports for chip thrust, gold wire, and ball tests.
Anti-Collision Protection: Each sensor includes independent overload protection to prevent precision deviations from errors.
Integrated Windows Interface: User-friendly OS with intuitive operation for displaying force distribution curves and data.
Versatile Application Scope: Ideal for semiconductor, LED packaging, automotive electronics, and microelectronic lead bonding.
Robust Build Quality: Constructed with 100% imported parts, weighing 95KG for stable and long-term operation.