Heat Sealing Automatic SIM Card Packing System Chip Card Packaging Machine

Name: Heat Sealing Automatic SIM Card Packing System Chip Card Packaging Machine
Brand: Shenzhen Wentong Machinery Co., Ltd.
SKU: 2210345495

Guangdong, ChinaShenzhen Wentong Machinery Co., Ltd.

US$18,000.00-25,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

WT-007BZJ

Packaging

Bag

Automatic Grade

Automatic

Packaging Material

Film

Application

SIM Cards/PVC Cards

Usage

Outpacking, Inner Packing

Type

Heat Sealing Machine

Packaging Material Mechanical Properties

Full Automatic Filling and Sealing Machine

Material Type

PVC Cards/Paper Cards

Sealing Method

Heat Sealing

Packaging Film

BOPP Film/OPP Film etc

Packaging Film Thickness

0.025mm-0.05mm

Output

8000 PCS/H

Flexibility

Compatible with Different Card Sizes

Card Material

Paper/PVC/Pet/PC/ABS etc

Control

PLC + Servo

Power Supply

AC 380V/50Hz

Total Power

3.5 Kw

Air Consumption

30L/Min

Transport Package

Export Wooden Box

Specification

L2400*W1500*H1700MM

Trademark

Origin

Shenzhen

HS Code

8422400090

Production Capacity

100sets/Year

Company profile

Shenzhen Wentong Machinery Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 8 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.67h

AI-Powered supplier vetting

SummaryThe supplier is identified as a factory in Shenzhen’s Guangming District, with stated production and sales of automated mechanical equipment and spare parts. It reports a professional R&D team, recent new-product activity, available SDK support, ODM services, and broad customization options. Inventory capability and several pre-sale and after-sales support measures are stated, including sample testing, manuals, training, and possible overseas engineer assistance. However, no evidence of certification holding or customer cases is provided. The supplier does not serve popular brands through OEM, lacks an overseas warehouse and showroom, and has no valid manufacturing-capacity contract with associated subcontractors. Service procedures exist, but records for assessment, corrective actions, and complaint handling are not documented in the provided information.

Supplier typeThe supplier is explicitly identified as a factory located in Shenzhen’s Guangming District, and its stated business scope includes production and sales of automated mechanical equipment and spare parts. Its company type is listed as combined, while the offshore business name is marked as not applicable.

After-Sales capabilityThe supplier states that it provides English manuals and video instructions, factory training for customer technical staff, and overseas engineer support when necessary. It also has service procedures for corrective actions and complaint handling, but no written records are available, and it has no overseas warehouse or showroom.

R&D capabilityThe supplier reports a professional R&D team, at least one new product during the past year, an available SDK, and ODM service availability. These statements provide explicit evidence of product-development capability and technical support for development activities.

Production capacityThe supplier is identified as a manufacturing factory with a stated 1,000.0 m² plant and a business scope covering production and sales of automated mechanical equipment and spare parts; it also reports inventory capability. However, it has no valid manufacturing-capacity contract with associated subcontractors, which limits evidence regarding subcontracted production governance.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. It also reports ODM service availability, directly supporting a broad customization offering.