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Hydroxyethyl Cellulose HEC Copper Foil Plating Additive 9004-62-0
US$15.00
25-19,999 kg
US$13.50
20,000+ kg
Sample price:US$100.00/kg.Request sample
Product profile
Customization
AvailableCAS No.
9004-62-0Formula
C29h52o21Model NO.
HECEINECS
618-387-5Environmental Protection
YesColor
WhiteAppearance
PowderKind
Metal Surface Disposal AgentUsage
Thickener for Paint & CosmeticsAcid-Base Property
Neutral Surface Disposal AgentpH
5.5 - 8.5Viscosity
5-100, 000+MPa·SSolubility
Soluble in Hot or Cold WaterIonic Character
Non-IonicTransport Package
DrumSpecification
25kg/220/TTrademark
WinchemGlobalOrigin
ChinaKey features
As a protective colloid, adsorbing onto the cathode surface to regulate copper deposition and minimize internal stress-induced warpage.
Forms a uniform adsorption film that promotes equiaxed grain growth, resulting in finer and more uniform copper crystal structure.
Improves bath wetting and hydrogen bubble release, significantly reducing pinhole formation on copper foil surfaces.
Non-ionic polymer remains stable across a wide pH and temperature range, ensuring consistent plating performance over long production runs.
Works synergistically with SPS, MPS, PEG, and gelatin in standard copper foil plating formulations.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs CertifiedExport Year: 1 Year CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.40h
About Our Factory & Business Background
AddressUnit 6, No. 52, Qipan Street, Wuchang District, Wuhan, Hubei, China
Plant Area128 square meters
Registered Capital1,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity25 kgs
Supply Chain Partners2
Our Production Capability & Technical Expertise
Main ProductsIndustrial Cleaning, Electroplating Pretreatment, Electroplating Industry, Aluminum Surface Treatment, Copper Foil Additives, Metal Working Fluid Additives, Fine Chemicals, Coating Pretreatment, Electroplating Additives, Surfactants
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2025-12-08
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice80%~100%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Product Q&A
Q:What is the primary function of HEC in copper foil plating?
A:
It acts as a protective colloid to regulate copper ion discharge, control warpage, refine grain structure, and reduce pinholes.
Q:What are the available packaging options?
A:
Standard options include 25kg and 200kg bags, and packaging can be customized according to requirements.
Q:Is the product compatible with other additives?
A:
Yes, it is compatible with standard multi-additive systems including SPS, MPS, PEG, and gelatin.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 25 kilograms.
Q:Can the product be customized?
A:
Yes, customization is available from samples and designs.
Send Inquiry
*To:
Wuhan Winchem Global Trading Co., Ltd.
Wuhan Winchem Global Trading Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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