Strong chelating ability with copper and nickel ions, significantly improving bath stability and extending service life.
As a key complexing agent in electroless copper plating, it ensures uniform and dense coating, effectively preventing "skip plating" and voids.
Excellent performance under alkaline conditions (1% solution pH 10.0-14.0), compatible with various additives and bath formulations.
Assay >75% (98% high-purity grade available), light yellow to colorless transparent viscous liquid, with strict quality control for consistent batch performance.
Beyond PCB electroless copper plating, also suitable for zinc-nickel alloy plating, heavy metal capture agents, water treatment, and textile auxiliaries.