High Thermal Conductivity: Thermal conductivity exceeds 260 W/M.K for efficient power module cooling.
Multiple Material Options: Available in 96% Alumina, 99.6% Alumina, BeO, AlN, and Silicon Nitride.
Advanced Metallization: Features Direct Bonded Copper (DBC), Direct Plated Copper (DPC), and AMB processes.
Customizable Specifications: Custom dimensions, structure, surface roughness, and metallization are supported.
In-house Manufacturing: Complete capabilities in forming, sintering, machining, glazing, and assembly.
Strict Quality Assurance: Highly trained QA staff uses advanced devices to ensure product requirements are met.
Fast Delivery Service: Rapid transition from prototype to production quantities with reliable service.
Comprehensive Support: Technical support for consultation, design, and prototypes is provided.