1.4mm 2.5lbs Sac305 Tin Silver Solder Wire for Electronics in Reel

Name: 1.4mm 2.5lbs Sac305 Tin Silver Solder Wire for Electronics in Reel
Brand: Foshan Xi Feng Tin Products Co., Ltd.
SKU: 2008852022

Guangdong, ChinaFoshan Xi Feng Tin Products Co., Ltd.

US$20.00-65.00

50 kg

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Type

Flux-cored Wire

Material

Copper / Copper Alloy

Model NO.

Soldering Materials

Flux Containing

Containing Flux

Slag Characteristic

Alkaline

Extended Length

10-20mm

Composition

Contain 99.3 of Tin and 0.7 of Copper

Feature

No Clean, Bright Spot, No Splash and Smokeless

Weight

2.5lbs Solder Wire

Alloy

Sac305 Solder Wire

Alloy 2

Sn96.5AG3.0cu0.5 Solder Wire

Alloy 3

96.5% Tin, 3% Silver, 0.5% Copper

Alloy Type

Lead Free Solder Wire

Certificate

RoHS Compliant

Diameter

1.4mm Solder Wire

Core

Ra Core Solder Wire

Core 2

Resin Cored Solder Wire

Core 3

Flux Cored Solder Wire

Application

for Electronics Manufacturing

Appliction 2

for Metal Sheet Soldering

Application 3

for HVAC Soldering

Transport Package

Spool

Specification

1000G

Trademark

XiFeng

Origin

Foshan, China

HS Code

831130000

Production Capacity

10800t

Company profile

High Repeat Buyers ChoiceYears of Export ExperienceMulti-language PioneerIn-stock Capacity

Foshan Xi Feng Tin Products Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 10 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤3.19h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier producing and processing solder strips, solder wire, and solder paste. It reports ISO9001 and SGS certification, quality assurance, and raw-material traceability. It supports broad customization, including sample-, design-, flexible-, minor-, and full customization, but does not provide 3D software design, ODM, SDK, or brand OEM services and reported no new products in the past year. Inventory capability is available, while no valid manufacturing-capacity contract with related subcontractors, overseas warehouse, overseas showroom, overseas agents, or branches is reported. Export activity has continued for 10 years, with 31%–40% of sales from exports and a one-month average lead time in both peak and off-season. Financial information is present only as year references, without sufficient performance evidence.

Supplier typeThe supplier explicitly identifies itself as a professional technical supplier and operates in the production, sales, and processing of solder strips and solder lines. Its offered products include solder wire and solder paste, and its products serve electronics, electrical, copper roofing, and plumbing applications.

CertificationsThe company states that it has passed ISO9001 international quality system certification and SGS certification. These are explicit certification claims supporting this field.

R&D capabilityThe supplier is described as a professional technical supplier and supports customization, but it reported no new products in the past year and does not offer ODM, SDK, or 3D software design services. These explicit limitations prevent a positive assessment of innovation capability.

Production capacityThe supplier reports production, sales, and processing operations for solder products, advanced technological equipment, a quality assurance system, inventory capability, and a one-month average lead time in both peak and off-season. However, it has no valid manufacturing-capacity contract with related subcontractors, so production capability is supported but not without a stated capacity-management gap.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, flexible customization, minor customization, and full customization. This is direct evidence of broad customization capability, although 3D software design services are not provided.