Low Melting Point Low Melt Temp Tin Bismuth Low Temperature Solder Wire Sn42bi58 42/58

Name: Low Melting Point Low Melt Temp Tin Bismuth Low Temperature Solder Wire Sn42bi58 42/58
Brand: Foshan Xi Feng Tin Products Co., Ltd.
SKU: 1989198392

Guangdong, ChinaFoshan Xi Feng Tin Products Co., Ltd.

US$25.00-65.00

50 kg

Sample price:US$6.00/piece.Request sample

Product profile

Customization

Available

Type

Rolling Wire

Material

Tin

Model NO.

Low Melting Point Solder Wire

Flux Containing

Not Containing Flux

Slag Characteristic

Alkaline

Extended Length

<10mm

Composition

Sac305, Sac0307, Sac07

Application

LED, PCB, Precise Instruments and Electronic Comp

Feature

No Clean, Bright Spot, No Splash and Smokeless

Feature 2

Low Melting Point

Feature 3

Low Temperature

Alloy

Sn42bi58 Solder Wire

Alloy 2

Solder Wire 42 58

Diameter

0.8mm, 1mm, 1.2m, 1.5mm, 2mm

Core

Solid Wire Without Flux

External Flux

Needed

Weight

100g Per Roll

Weight 2

500g Per Roll

Weight 3

200g Per Roll

Weight 4

250g Per Roll

Application 2

for Temperature or Heat Senstive IC Components

Transport Package

Spool

Specification

200g

Trademark

XF SOLDER

Origin

Foshan, China

HS Code

831130000

Production Capacity

10800t

Company profile

High Repeat Buyers ChoiceYears of Export ExperienceMulti-language PioneerIn-stock Capacity

Foshan Xi Feng Tin Products Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 10 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤3.24h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier producing and processing solder strips, solder wire, and solder paste. It reports ISO9001 and SGS certification, quality assurance, and raw-material traceability. It supports broad customization, including sample-, design-, flexible-, minor-, and full customization, but does not provide 3D software design, ODM, SDK, or brand OEM services and reported no new products in the past year. Inventory capability is available, while no valid manufacturing-capacity contract with related subcontractors, overseas warehouse, overseas showroom, overseas agents, or branches is reported. Export activity has continued for 10 years, with 31%–40% of sales from exports and a one-month average lead time in both peak and off-season. Financial information is present only as year references, without sufficient performance evidence.

Supplier typeThe supplier explicitly identifies itself as a professional technical supplier and operates in the production, sales, and processing of solder strips and solder lines. Its offered products include solder wire and solder paste, and its products serve electronics, electrical, copper roofing, and plumbing applications.

CertificationsThe company states that it has passed ISO9001 international quality system certification and SGS certification. These are explicit certification claims supporting this field.

R&D capabilityThe supplier is described as a professional technical supplier and supports customization, but it reported no new products in the past year and does not offer ODM, SDK, or 3D software design services. These explicit limitations prevent a positive assessment of innovation capability.

Production capacityThe supplier reports production, sales, and processing operations for solder products, advanced technological equipment, a quality assurance system, inventory capability, and a one-month average lead time in both peak and off-season. However, it has no valid manufacturing-capacity contract with related subcontractors, so production capability is supported but not without a stated capacity-management gap.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, flexible customization, minor customization, and full customization. This is direct evidence of broad customization capability, although 3D software design services are not provided.