What payment terms do you accept?

We accept LC, T/T, D/P, and PayPal as payment methods.

How is the solder paste applied?

Apply using stencil printing with a squeegee, place components, and then reflow solder in an oven or on a hot plate.

Type 3 Tin Lead Paste Solder 60 40 Sn60pb40 for Reflow Oven

Name: Type 3 Tin Lead Paste Solder 60 40 Sn60pb40 for Reflow Oven
Brand: Foshan Xi Feng Tin Products Co., Ltd.
SKU: 1993574645

Guangdong, ChinaFoshan Xi Feng Tin Products Co., Ltd.

US$20.00-60.00

30 kg

Sample price:US$20.00/piece.Request sample

Product profile

Customization

Available

Type

Solder Paste

Material

Tin

Model NO.

Paste Solder

Flux Containing

Containing Flux

Slag Characteristic

Alkaline

Extended Length

<10mm

Powder Size

Type 3: 25 to 45 Microns

Powder Size 2

Type 4: 20 to 38 Microns

Flux

No Clean Flux

Alloy 2

Sn63pb37

Alloy 3

Sn60pb40

Alloy 4

Sn55pb45

Alloy 5

Sn50pb50

Packing

Jar

Packing 2

Syringe

Shipping

Courier / Air Freight

Shelf Life

6months

Storage

0 to 10 Degree Celsius

Application 2

SMD Components Soldering

Application 3

for SMT Soldering

Application 4

for Reflow Oven Reflow Soldering

Transport Package

Foam Box

Specification

100g to 1000g

Trademark

XF Solder

Origin

China

HS Code

3810100000

Production Capacity

30tons/Month

Key features

Multiple Alloy Options: Available in Sn63Pb37, Sn60Pb40, Sn50Pb50, Sn55Pb45, and Sn60Pb40 variants.

Flexible Customization: Offers full, minor, and flexible customization from samples or designs.

Wide Application Scope: Suitable for smartphones, automotive ECUs, industrial automation, and hobbyist projects.

Precise Powder Sizing: Type 3: 25-45 Microns; Type 4: 20-38 Microns for optimal stencil printing.

No Clean Flux: Contains no-clean flux for efficient soldering without post-cleaning residue.

Secure Packaging: Available in jars and syringes to ensure product integrity and ease of use.

Strict Quality Control: 100% visual and functional inspection for all finished products.

Global Shipping Options: Fast delivery via courier or air freight from Guangzhou Port.

Company profile

High Repeat Buyers ChoiceYears of Export ExperienceMulti-language PioneerIn-stock Capacity

Foshan Xi Feng Tin Products Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 10 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤4.10h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier producing and processing solder strips, solder wire, and solder paste. It reports ISO9001 and SGS certification, quality assurance, and raw-material traceability. It supports broad customization, including sample-, design-, flexible-, minor-, and full customization, but does not provide 3D software design, ODM, SDK, or brand OEM services and reported no new products in the past year. Inventory capability is available, while no valid manufacturing-capacity contract with related subcontractors, overseas warehouse, overseas showroom, overseas agents, or branches is reported. Export activity has continued for 10 years, with 31%–40% of sales from exports and a one-month average lead time in both peak and off-season. Financial information is present only as year references, without sufficient performance evidence.

Supplier typeThe supplier explicitly identifies itself as a professional technical supplier and operates in the production, sales, and processing of solder strips and solder lines. Its offered products include solder wire and solder paste, and its products serve electronics, electrical, copper roofing, and plumbing applications.

CertificationsThe company states that it has passed ISO9001 international quality system certification and SGS certification. These are explicit certification claims supporting this field.

R&D capabilityThe supplier is described as a professional technical supplier and supports customization, but it reported no new products in the past year and does not offer ODM, SDK, or 3D software design services. These explicit limitations prevent a positive assessment of innovation capability.

Production capacityThe supplier reports production, sales, and processing operations for solder products, advanced technological equipment, a quality assurance system, inventory capability, and a one-month average lead time in both peak and off-season. However, it has no valid manufacturing-capacity contract with related subcontractors, so production capability is supported but not without a stated capacity-management gap.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, flexible customization, minor customization, and full customization. This is direct evidence of broad customization capability, although 3D software design services are not provided.