Advanced Multi-Layer HDI Circuit Board Assembly with High Frequency

Name: Advanced Multi-Layer HDI Circuit Board Assembly with High Frequency
Brand: Shenzhen Core Hecheng Electronic Technology Co., Ltd.
SKU: 2208517655

Guangdong, ChinaShenzhen Core Hecheng Electronic Technology Co., Ltd.

US$0.01

1 Piece

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Metal Coating

Enig / HASL / OSP / Silver etc.

Mode of Production

SMT / DIP / PCB Manufacturing

Model NO.

E66383

Layers

From 2 Layers to 50 Layers

Base Material

Fr4/ High Tg Fr4/ Metal Core / Cem

Certification

RoHS, CCC, ISO

Customized

Condition

New

Technology

SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to

SMT Line

11 SMT Lines

SMT Capability

20, 000, 000 Points Per Day

DIP Capability

300, 000 Points Per Day

Transport Package

UPS/DHL/TNT/EMS/FedEx

Specification

Custom

Trademark

OEM

Origin

China

Company profile

Importers and ExportersIn-stock CapacityFast DeliveryOverseas Services

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/Factory, Group CorporationExport Year: 2012-06-06Nearest Port: ShenzhenAverage Response Time: ≤4.32hTerms of Payment: T/T, PayPal, Western Union, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP, CIP

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based trading company with a focus on electronic products and related technology services. It shows moderate export activity but lacks OEM and ODM services. Although it has some R&D activity, its innovation capability is limited by a minimal number of engineers and no SDK availability. Financial data is available, but specifics on financial credibility and certifications are missing. The company offers some after-sales services and has in-stock service capacity, but lacks overseas warehousing and showrooms.

Supplier typeThe supplier is identified as a trading company specializing in wholesale and retail, located in Shenzhen, Bao'an District.

After-Sales capabilityThe supplier provides integrated solutions from pre-sales to post-sales, indicating a structured after-sales service capability.

R&D capabilityThe supplier has launched new products recently but has minimal research and development capacity with only one engineer and no SDK availability.

Customization capabilityThe supplier can provide customization from samples but does not offer ODM or OEM services for popular brands.