Cheap Turnkey DIP Contracting Manufacturer SMT PCB Printed Circuit Assembly

Name: Cheap Turnkey DIP Contracting Manufacturer SMT PCB Printed Circuit Assembly
Brand: Shenzhen Core Hecheng Electronic Technology Co., Ltd.
SKU: 2181916685

Guangdong, ChinaShenzhen Core Hecheng Electronic Technology Co., Ltd.

US$0.01-10.00

1 Piece

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Metal Coating

Gold

Mode of Production

SMT

Model NO.

G37452

Layers

Multilayer

Base Material

FR-4

Certification

RoHS, CCC, ISO

Customized

Condition

New

Quality Standard

Ipc Class 2 / Class 3

Flame Retardant Properties

94V0

Layers Count

6 Layser

Mininum Trace Width

2.5 Mil

Max Copper Thickness

10 Oz

Transport Package

UPS/DHL/TNT/EMS/FedEx

Origin

China

HS Code

8504409902

Production Capacity

5, 000, 000 Pieces/Year

Company profile

Importers and ExportersIn-stock CapacityFast DeliveryOverseas Services

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/Factory, Group CorporationExport Year: 2012-06-06Nearest Port: ShenzhenAverage Response Time: ≤4.20hTerms of Payment: T/T, PayPal, Western Union, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP, CIP

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based trading company with a focus on electronic products and related technology services. It shows moderate export activity but lacks OEM and ODM services. Although it has some R&D activity, its innovation capability is limited by a minimal number of engineers and no SDK availability. Financial data is available, but specifics on financial credibility and certifications are missing. The company offers some after-sales services and has in-stock service capacity, but lacks overseas warehousing and showrooms.

Supplier typeThe supplier is identified as a trading company specializing in wholesale and retail, located in Shenzhen, Bao'an District.

After-Sales capabilityThe supplier provides integrated solutions from pre-sales to post-sales, indicating a structured after-sales service capability.

R&D capabilityThe supplier has launched new products recently but has minimal research and development capacity with only one engineer and no SDK availability.

Customization capabilityThe supplier can provide customization from samples but does not offer ODM or OEM services for popular brands.