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High Density Prototype PCB Assembly with Blind Hole Technology
US$0.01
1 Piece
Sample price:US$0.00/piece.Request sample
Product profile
Customization
AvailableMetal Coating
Enig / HASL / OSP / Silver etc.Mode of Production
SMT / DIP / PCB ManufacturingModel NO.
PCBLayers
From 2 Layers to 50 LayersBase Material
Fr4/ High Tg Fr4/ Metal Core / CemCertification
RoHS, CCC, ISOCustomized
CustomizedCondition
NewSolder Mask Color
Green,Blue,Yellow,White,Black,RedSpecial Process
Buried Hole, Blind Hole, Partial High Density, BacCopper Thickness
1/2oz,1oz,2oz,3oz,4oz,5oz-10 OzLayer Count
1-50 LayersQuality Standard
Ipc Class 2 and Ipc Class 3Transport Package
UPS/DHL/TNT/EMS/FedExSpecification
CustomTrademark
OEMOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory, Group CorporationExport Year: 2012-06-06Nearest Port: ShenzhenAverage Response Time: ≤2.77hTerms of Payment: T/T, PayPal, Western Union, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP, CIP
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPCBA Assembly, PCBA, PCB, Quick Turn PCB Assembly, Turnkey PCB Assembly, Cheap PCB Assembly, Prototype PCB Assembly, Volume PCB Assembly, Low Cost PCB
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia
Send Inquiry
*To:Shenzhen Core Hecheng Electronic Technology Co., Ltd.
*Content:
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