Mixed-Technology Surface-Mount Through-Hole Automated-Test BGA-Assembled Fine-Pitch High-Complexity Low-Power High-Speed High-Thermal PCBA

Name: Mixed-Technology Surface-Mount Through-Hole Automated-Test BGA-Assembled Fine-Pitch High-Complexity Low-Power High-Speed High-Thermal PCBA
Brand: Shenzhen Core Hecheng Electronic Technology Co., Ltd.
SKU: 2184681505

Guangdong, ChinaShenzhen Core Hecheng Electronic Technology Co., Ltd.

US$0.01

1 Piece

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Metal Coating

Enig / HASL / OSP / Silver etc

Mode of Production

SMT / DIP / PCB Manufacturing

Model NO.

G78304

Layers

From 2 Layers to 50 Layers

Base Material

Fr4/ High Tg Fr4/ Metal Core / Cem

Certification

RoHS, CCC, ISO

Customized

Condition

New

Solder Mask Color

Green,Blue,Yellow,White,Black,Red

Special Process

Buried Hole, Blind Hole, Partial High Density, Bac

Copper Thickness

1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz

Layer Count

1-50 Layers

Quality Standard

Ipc Class 2 and Ipc Class 3

Transport Package

UPS/DHL/TNT/EMS/FedEx

Specification

Custom

Trademark

OEM

Origin

China

Company profile

Importers and ExportersIn-stock CapacityFast DeliveryOverseas Services

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/Factory, Group CorporationExport Year: 2012-06-06Nearest Port: ShenzhenAverage Response Time: ≤2.77hTerms of Payment: T/T, PayPal, Western Union, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP, CIP

About Our Factory & Business Background

AddressShenzhen, Guangdong, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsPCBA Assembly, PCBA, PCB, Quick Turn PCB Assembly, Turnkey PCB Assembly, Cheap PCB Assembly, Prototype PCB Assembly, Volume PCB Assembly, Low Cost PCB