High Compatibility Sn77.2in20AG2.8 Solder Preform for Hybrid Alloy Electronic Packaging

Name: High Compatibility Sn77.2in20AG2.8 Solder Preform for Hybrid Alloy Electronic Packaging
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: 2281409425

Guangdong, ChinaGuangzhou Xianyi Electronic Technology Co., Ltd.

US$0.05-20.00

50 Pieces

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Transport Package

Vacuum Packaging

Specification

Customized to meet your specific needs

Trademark

Guangzhou XianYi Electronic Technology Co., Ltd

Origin

Guangzhou, Guangdong, China

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExhibition ExperiencePatents Awarded

Guangzhou Xianyi Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 3 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤9.50h

AI-Powered supplier vetting

SummaryThe supplier specializes in a wide range of products including ceramic matrix composites, semiconductor devices, and photovoltaic equipment. They have strong customization capabilities and a robust R&D department that has released new products in the past year. They hold ISO certifications, indicating a commitment to quality and environmental management. However, they lack OEM services for popular brands and do not have notable financial data available, raising questions about their financial credibility.

Supplier typeThe supplier deals in a diverse range of products, including ceramic matrix composites, electronic components, and semiconductor devices.

CertificationsThe supplier holds ISO9001:2015 and ISO14001 certifications, suggesting adherence to quality and environmental standards.

After-Sales capabilityThe supplier has clear procedures and records for handling customer complaints and corrective actions, indicating a structured approach to after-sales service.

Financial creditThe supplier's financial data shows zero revenue, cost, and profit for the last year, raising concerns about their financial credibility.

R&D capabilityThe supplier demonstrated innovation capability with new products developed in the past year and offers ODM services.

Production capacityThe supplier offers flexible customization options, indicating strong production capabilities.

Customization capabilityThe supplier provides a wide range of customization services, from minor adjustments to full customization.

Client casesThe supplier does not provide OEM services for known brands, indicating limited high-profile customer collaborations.

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High Compatibility Sn77.2in20AG2.8 Solder Preform for Hybrid Alloy Electronic Packaging