High Roundness Au80Sn20 Solder Ball for Flip Chip Packaging

Name: High Roundness Au80Sn20 Solder Ball for Flip Chip Packaging
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: 2281575945

Guangdong, ChinaGuangzhou Xianyi Electronic Technology Co., Ltd.

US$5.00-50.00

500 k pcs

Sample price:US$10.00/k pcs.Request sample

Product profile

Customization

Available

Transport Package

Vacuum Packaging

Specification

Customized to meet your specific needs

Trademark

Guangzhou XianYi Electronic Technology Co., Ltd

Origin

Guangzhou, Guangdong, China

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExhibition ExperiencePatents Awarded

Guangzhou Xianyi Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 3 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤10.24h

AI-Powered supplier vetting

SummaryThe supplier demonstrates broad capabilities in electronic, ceramic, metal, alloy, optical, photovoltaic, semiconductor, and related material fields, with stated R&D, ODM, and extensive customization services. Quality and supplier-management processes are documented, including 23 quality inspectors, standardized finished-product inspection, corrective-action procedures, and customer-complaint handling. ISO9001:2015 and ISO14001 certifications are reported, alongside other unspecified certifications. Delivery is stated as within 15 workdays in both peak and off-peak periods, with Guangzhou as the nearest port. However, the supplier does not provide OEM services for well-known brands, lacks an available SDK, has no stated overseas service countries, and the submitted prior-year financial fields are all zero, limiting confidence in financial credibility. No customer cases are provided.

CertificationsThe supplier reports ISO9001:2015 and ISO14001 management-system certifications, plus other unspecified product or management certifications. These explicit certifications support quality and environmental-management capability, although the unspecified certifications cannot be independently assessed from the provided data.

After-Sales capabilityThe supplier reports written procedures and records for service-capability assessment, corrective and preventive actions, and effective customer-complaint handling. This is direct evidence of structured after-sales and issue-resolution processes, although the actual service performance outcomes are not provided.

R&D capabilityThe supplier states that it had new products during the past year and provides ODM services, demonstrating some product-development capability. However, it reports no available SDK and provides no detailed R&D staffing, investment, patents, or development results, so innovation strength is only partially evidenced.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, flexible customization, and minor customization, and also reports ODM availability. The repeated evidence indicates broad customization coverage across different customer input levels.