What are your terms of payment?

T/T 100% before delivery. The shipping details will be provided upon shipment of the products.

What is the delivery time?

Usually 2-3 days for samples and 2-3 weeks for bulk orders. Subject to the actual order details.

Low Void Au78Sn22 Solder Ball for Third-Generation Semiconductor Sic Packaging

Name: Low Void Au78Sn22 Solder Ball for Third-Generation Semiconductor Sic Packaging
Brand: Guangzhou Xianyi Electronic Technology Co., Ltd.
SKU: 2281610545

Guangdong, ChinaGuangzhou Xianyi Electronic Technology Co., Ltd.

US$5.00-50.00

500 k pcs

Sample price:US$10.00/k pcs.Request sample

Product profile

Customization

Available

Transport Package

Vacuum Packaging

Specification

Customized to meet your specific needs

Trademark

Guangzhou XianYi Electronic Technology Co., Ltd

Origin

Guangzhou, Guangdong, China

Key features

National High-Tech Enterprise: Established in 2008, specializing in high-reliability microelectronic packaging interconnect materials.

Low Void Au78Sn22 Alloy: Specifically designed for third-generation semiconductor SiC packaging applications.

100% Finished Product Inspection: Includes both functional and visual inspection to ensure high quality and reliability.

Fast Sample Delivery: Samples can be delivered within 2-3 days for quick testing and evaluation.

Flexible Customization Options: Offers customization from samples, designs, and flexible minor customization services.

ISO Certified Quality: Certified under ISO9001:2015 and ISO14001 management systems for consistent quality.

Professional Technical Support: Provides professional technical consultations and suitable process solutions for customers.

Experienced Manufacturer: 18 years of experience in producing solder preforms, paste, balls, and gold bonding wire.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExhibition ExperiencePatents Awarded

Guangzhou Xianyi Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 3 Years CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤9.10h

AI-Powered supplier vetting

SummaryThe supplier demonstrates broad capabilities in electronic, ceramic, metal, alloy, optical, photovoltaic, semiconductor, and related material fields, with stated R&D, ODM, and extensive customization services. Quality and supplier-management processes are documented, including 23 quality inspectors, standardized finished-product inspection, corrective-action procedures, and customer-complaint handling. ISO9001:2015 and ISO14001 certifications are reported, alongside other unspecified certifications. Delivery is stated as within 15 workdays in both peak and off-peak periods, with Guangzhou as the nearest port. However, the supplier does not provide OEM services for well-known brands, lacks an available SDK, has no stated overseas service countries, and the submitted prior-year financial fields are all zero, limiting confidence in financial credibility. No customer cases are provided.

CertificationsThe supplier reports ISO9001:2015 and ISO14001 management-system certifications, plus other unspecified product or management certifications. These explicit certifications support quality and environmental-management capability, although the unspecified certifications cannot be independently assessed from the provided data.

After-Sales capabilityThe supplier reports written procedures and records for service-capability assessment, corrective and preventive actions, and effective customer-complaint handling. This is direct evidence of structured after-sales and issue-resolution processes, although the actual service performance outcomes are not provided.

R&D capabilityThe supplier states that it had new products during the past year and provides ODM services, demonstrating some product-development capability. However, it reports no available SDK and provides no detailed R&D staffing, investment, patents, or development results, so innovation strength is only partially evidenced.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, flexible customization, and minor customization, and also reports ODM availability. The repeated evidence indicates broad customization coverage across different customer input levels.

Product Q&A

Q:Are you a manufacturer or trading company?

We are a manufacturer with 18 years experience in the production of solder preforms, low-void solder paste & solder paste, solder balls, gold bonding wire & ribbo solder wire.

Q:Do you accept OEM orders?

No, we cannot change the packaging and factory labels. For further details, please contact our sales representative.

Q:What is your advantage?

Manufacturers for better prices, good quality and reputation, professional sales services.

Q:Can you offer free samples for testing?

We can arrange samples for your company based on the situation. Please contact our sales representative for specific details.

Q:How to store and how long is the warranty period?

Different products have varying storage requirements. Please store them properly according to the conditions specified in the product instructions we provided.