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Custom Metal Terminal Carrier Strip Electrical Connector Precision Stamped Component
US$22.00
2-99 Pieces
US$12.00
100-499 Pieces
US$5.00
500-999 Pieces
US$1.80
1,000+ Pieces

Product specifications

Size

Sample price:US$50.00/piece.Request sample

Product profile

Customization

Available

Standard

Custom

Material

Stainless Steel

Model NO.

custom

Connection

Custom Item

Surface Treatment

Polishing, Plating, Anodizing, Black Oxide, etc.

Head Type

Custom Item

Other Material Options

Stainless Steel , Copper, Brass, Nickel, Aluminum

Precision Capability

Ultra-Fine Features Down to 0.02 mm

Consistency

High Repeatability for Mass Production

Cost Advantage

Ideal for Thin Metal & Complex Patterns Vs CNC

MOQ

Flexible (Prototype to Volume)

Production Mode

Sheet / Strip / Reel for Automation

Other Processing Method

CNC, Laser Cutting, Chemical Etching, Etched

Custom Hole Shapes

Round, Square, Diamond, Custom

Sample Lead Time

3-7 Days

Mass Production

14-20 Days(Depending on Quantity)

M0q

100-500 PCS (Depending on Size)

Size Range

Customizable (Typical: < 300 X 300 mm)

Thickness

0.01 mm - 0.5 mm (Etching Optimal: 0.02-0.3 mm)

Tolerance

+0.005 mm ~+0.02 mm

Transport Package

Anti-Static Bag + Foam Protection + Export Carton

Specification

Custom item

Trademark

NKEYTO

Origin

Shenzhen, China

HS Code

8516800000

Production Capacity

50000 PCS /Year

Key features

Fully Customized Design: Supports full customization for material, thickness, plating, and structural layout.
No Burr & High Consistency: Ensures burr-free edges and high repeatability suitable for mass production.
Flexible MOQ for Prototypes: Accepts orders starting from 1 piece, supporting both prototypes and mass volume.
Multiple Material Options: Available in Stainless Steel, Copper, Brass, Nickel, Aluminum, and more.
Automated Production Ready: Designed in carrier strip, reel-to-reel formats for efficient automated assembly.
Comprehensive Surface Treatments: Offers passivation, polishing, electroplating (Ni, Au, Sn, Ag), and blackening.
Direct Factory Source: Integrated manufacturer in Shenzhen with in-house resources and supply chain.

Company profile

Importers and ExportersFull CustomizationODM ServicesFlexible Customization
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.25h

AI-Powered supplier vetting

SummaryThe supplier is a limited company focused on precision metal solutions, supported by laser cutting and CNC. It offers prototype development, small-batch customization, mass production, multiple metal materials, and surface treatments. Evidence indicates ODM services, recent new-product activity, OEM service for well-known brands, and flexible customization. Production information reports 100,000,000 precision etched metal parts, while the manufacturing plant covers 150.0 m². Quality-control evidence is incomplete: test equipment is stated as 0, and quality assurance and traceability statuses are unknown. The supplier has one R&D engineer and 11–20 quality-control staff. It maintains an overseas warehouse and accepts several trade and payment terms, with stated lead times within 15 working days in both peak and off-season periods. Service-management procedures are weak or undocumented, including complaint handling and corrective/preventive actions. No certification information or specific customer cases is...
Supplier typeThe supplier is a limited company providing integrated precision metal manufacturing, including laser cutting, CNC-supported solutions, prototype development, small-batch customization, and mass production. Its listed materials and finishes indicate a metal parts manufacturer rather than a purely trading or service-only company.
After-Sales capabilityOne R&D engineer is responsible for technical support for after-sales service, and the supplier has an overseas warehouse. However, the supplier reports no written procedures or records for complaint handling and corrective/preventive actions, so formal after-sales management appears insufficiently documented.
R&D capabilityThe supplier reports new products during the past year, provides ODM services, and has one R&D engineer responsible for customer requirement confirmation, technical support, and new product development. However, it has no available SDK, so the evidence supports product-development capability but not broader development-platform capability.
Production capacityThe supplier reports 100,000,000 precision etched metal parts, supports prototype, small-batch, and mass production, and uses materials including stainless steel, copper, brass, aluminum, nickel, and beryllium copper. Its 150.0 m² plant and stated production information support manufacturing capability, although quality-control test equipment is reported as 0 in another slice.
Customization capabilityThe supplier explicitly offers customization from samples and designs, full, minor, and flexible customization, together with ODM services. It also supports varied materials, coatings, plating, and other customized surface finishes, providing strong direct evidence of customization capability.
Client casesThe supplier states that it provides OEM services for well-known brands, which is evidence of at least one type of customer engagement. No brand names, project details, product examples, or verifiable case descriptions are provided, limiting the depth of customer-case evidence.

Product Q&A

Q:What materials are commonly used for semiconductor lead frames?
A:
Common materials used for semiconductor lead frames include: Copper (Cu) M1 Copper Copper alloys Nickel-plated copper materials Other customized conductive materials Copper is widely used because of its excellent electrical conductivity, thermal conductivity, and mechanical performance. Material selection depends on application requirements, including electrical performance, heat dissipation, mechanical strength, and surface plating requirements.
Q:How is gold plating thickness selected for semiconductor lead frames?
A:
The gold plating thickness for semiconductor lead frames is determined according to the function of the gold layer and application requirements. Important factors include: Wire bonding method; Gold wire specifications; Electrical contact requirements; Reliability requirements; Operating environment; Cost targets. The suitable gold thickness should be selected based on actual semiconductor lead frame performance requirements.

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*To:Shenzhen Xintu Precision Hardware Co., Ltd.
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