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Elsky Fanless Mini PC Ipc6900 CPU Whiskey Lake 8th Generation Core I3
US$155.00
1-9 Sets
US$152.00
10-49 Sets
US$149.00
50-99 Sets
US$145.00
100+ Sets
Product profile
Customization
AvailableOperating System
Support Win 11, Win 10, Linux, etc.Power Supply
1*DC_in/1*4pin Phoenix Terminal;Support 12V/19VModel NO.
IPC6900-i3 8145UNetwork Features
Realtek 8111h Gigabit Network Card;1*Mini_PcieDisplay
Integrated In_Tel UHD Ultra-Core Graphics CardSerial Port Function
2COM/6COM Optional;2*WiFi Antenna InterfaceSound
Realtek Alc662/892/880;Line_out;Mic_inHard Disk
1*M.2 Interface;1*SATA2 Interface;Optional 1*MsataOperating Temperature
-10℃~60℃Working Humidit
5%~95% Relative Humidity, No CondensationUSB Function
2*USB3.1; 6*USB2.0 InterfaceSwitch Function
1*Power Button, Switch ButtonBIOS
Ami BIOS, Support Power-on, Scheduled, RemoteWatch Dog
Watchdog Programming, Hardware Reset FunctionCPU
Core i3HDD Capacity
1TBGPU
IntelMemory Capacity
64GBMemory Type
DDR4Use
Commercial, Educational, Industrial, Home, GameCPU Frequency
Dual Core2.1GHzTransport Package
CartonSpecification
220mm (L)*210mm (W)*80mm(H)Trademark
Elsky/OEM/ODMOrigin
Guangdong, ChinaHS Code
8471414000Production Capacity
100000 Pieces Per MonthCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 16 year CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.21h
AI-Powered supplier vetting
SummaryThe supplier is identified as a trading company in Longgang District, Shenzhen. It offers extensive customization, ODM, OEM for well-known brands, and SDK-supported R&D, with new products reported in the past year. Production-related evidence includes 12 quality inspectors, stated motherboard productivity of 100,000 sets, and standardized finished-product inspection instructions. Service procedures exist for supplier assessment, corrective actions, and complaints, but records are absent. Overseas infrastructure is limited: no overseas warehouse, showroom, agents, branches, or offline trade-show participation, and the supplier reports services in zero countries. Financial and systems information is inconsistent or incomplete, so credibility cannot be established from the provided data. No certification information or specific customer cases is provided.
R&D capabilityThe supplier reports new products within the past year, provides ODM services, offers an available SDK, and supports multiple forms of design customization. These are explicit indicators of product-development and technical design capability, although 3D software design services are expressly unavailable.
Production capacityThe supplier reports 12 quality assurance and quality control inspectors, motherboard productivity of 100,000 sets, soldering and oven equipment, and uniformly followed finished-product inspection instructions. The evidence supports stated production and quality-control capability, though it does not fully define manufacturing scope or capacity across all products.
Customization capabilityThe supplier explicitly offers customization from samples, full customization, customization from designs, minor customization, and flexible customization. This repeated evidence demonstrates broad customization coverage, while 3D software design services are specifically excluded.
Client casesThe supplier states that it provides OEM services for well-known brands, which is evidence of claimed branded-customer experience. However, no customer names, project details, or verifiable case records are provided, so the depth and independently verifiable quality of these cases cannot be assessed.
Send Inquiry
*To:
Shenzhen Elsky Technology Co., Ltd.
Shenzhen Elsky Technology Co., Ltd.*Content:
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