Manufacturer Mini-Itx Embedded Board for IoT - Dual LAN, 6USB, M. 2 Nvme Support

Name: Manufacturer Mini-Itx Embedded Board for IoT - Dual LAN, 6USB, M. 2 Nvme Support
Brand: Shenzhen Elsky Technology Co., Ltd.
SKU: 2183735815

Guangdong, ChinaShenzhen Elsky Technology Co., Ltd.

US$242.00

1-49 Pieces

US$237.00

50+ Pieces

Product profile

Customization

Available

Integrated Graphics

Main Chipset

Intel

Model NO.

QM13P-I7 1360P

Maximum Memory Capacity

64G

Structure

Mini-ITX

Memory

DDR4

SATA Interface

SATA3.0

CPU Socket

BGA1744

Main Board Structure

Integrated

CPU

Intel Core 13th Gen I7-1360p

Total Cores and Threads

12 Cores 16 Threads

Storage

1*M.2, 1*SATA SSD

Operating Temperature

-10℃~60℃

Operating Humidity

5%~95% Relative Humidity, No Condensation

Operating System

Support Windows11, Windows10, Linux, etc.

Transport Package

Carton

Specification

170mm*170mm*21mm(Fan thickness included)

Trademark

Intel

Origin

Shenzhen, China

Production Capacity

100000

Company profile

Patents AwardedSelf-brandedExperienced Team

Shenzhen Elsky Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 16 year CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.05h

AI-Powered supplier vetting

SummaryThe supplier is identified as a trading company in Longgang District, Shenzhen. It offers extensive customization, ODM, OEM for well-known brands, and SDK-supported R&D, with new products reported in the past year. Production-related evidence includes 12 quality inspectors, stated motherboard productivity of 100,000 sets, and standardized finished-product inspection instructions. Service procedures exist for supplier assessment, corrective actions, and complaints, but records are absent. Overseas infrastructure is limited: no overseas warehouse, showroom, agents, branches, or offline trade-show participation, and the supplier reports services in zero countries. Financial and systems information is inconsistent or incomplete, so credibility cannot be established from the provided data. No certification information or specific customer cases is provided.

R&D capabilityThe supplier reports new products within the past year, provides ODM services, offers an available SDK, and supports multiple forms of design customization. These are explicit indicators of product-development and technical design capability, although 3D software design services are expressly unavailable.

Production capacityThe supplier reports 12 quality assurance and quality control inspectors, motherboard productivity of 100,000 sets, soldering and oven equipment, and uniformly followed finished-product inspection instructions. The evidence supports stated production and quality-control capability, though it does not fully define manufacturing scope or capacity across all products.

Customization capabilityThe supplier explicitly offers customization from samples, full customization, customization from designs, minor customization, and flexible customization. This repeated evidence demonstrates broad customization coverage, while 3D software design services are specifically excluded.

Client casesThe supplier states that it provides OEM services for well-known brands, which is evidence of claimed branded-customer experience. However, no customer names, project details, or verifiable case records are provided, so the depth and independently verifiable quality of these cases cannot be assessed.