High Precision Grinding: Delivers flawless lapping and polishing with advanced CBN and diamond wheels for semiconductor and ceramic materials.
Four Independent Motors: Stepless speed regulation ensures stability, smooth operation, and freedom from impact or vibration.
Real-time Thickness Detection: Upper disc sensors provide online detection for precision thickness measurement and deformation adjustments.
Three-Stage Pressure Control: High-precision airbag system manages pre-pressure, main pressure, and post-pressure for accuracy.
Thermal Balance System: Constant temperature system prevents plate deformation, ensuring perfect cuts and polish every time.
PLC and HMI Control: User-friendly interactive interface offers flexible, reliable control for maximum operational efficiency.
Customization Available: One-stop custom solutions designed by R&D team based on workpiece drawings and tolerance requirements.
Comprehensive After-Sales: Includes remote video support, overseas engineer dispatch, spare parts supply, and training services.