Ultra-Fine Diameter Range: Available from 0.007mm to 0.05mm, enabling thinner diamond wires and reduced kerf loss.
Superior Tensile Strength: Exceeds 3000 MPa for ultra-fine wires, offering better fatigue resistance than steel cores.
Plating-Ready Surface: Smooth, clean surface free of cracks and burrs ensures stable nickel coating and diamond deposition.
High Straightness: Sag height >450mm per 500mm ensures excellent loop stability for high-speed production lines.
Reduced Breakage Rate: Proven >20% reduction in breakage rate compared to conventional steel core wires in PV processes.
ISO Certified Manufacturer: ISO 9001, RoHS, and REACH certified with strict quality control from powder to finished wire.
Customized Specifications: Tailored diameter, line speed, and process requirements for PV, semiconductor, and sapphire applications.