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Quasi-Spherical Silver Powders as Conductive Fillers
US$1.58
500 g
Sample price:US$1.58/g.Request sample
Product profile
Customization
AvailableApplication
Aviation, Electronics, IndustrialPurity
>99.99%Model NO.
Quasi-Spherical Silver Powders as Conductive FillAlloy
Non-alloyType
Silver PowderPowder
PowderApplication Scope
Fields Such as Semiconductors, Photovoltaics,etcAnnual Production Capacity
20 Tons/YearGrade
CustomizableApplication Scope1
Fields Such as Semiconductors, PhotoTransport Package
420mm*345mm*180mm, Each Box Contains 20 CansSpecification
500gTrademark
Qian JinghongOrigin
SichuanProduction Capacity
20 Tons/YearCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedNearest Port: Chongqing PortAverage Response Time: ≤2.89h CertifiedTerms of Payment: LC, T/T, D/P, etc.
About Our Factory & Business Background
Address1504, No. 666 Jinfu Road, Jinniu District, Chengdu
Registered Capital2,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 Kg
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsHigh-Activity Coated Composite Welding Electrode/Rod, Flux-Cored Silver Welding Rod, Flux-Cored Aluminum Welding Rod, Diamond Tool And Mining Wire Saw, Cemented Carbide Pick Tool
QA/QC inspectors1 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instruction but no written records
Traceability of Raw MaterialsYes
Our Industry Experience & Global Business Record
Year of Establishment2018-06-21
Main MarketsDomestic
Repeat Buyers Choice50%~80%
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Send Inquiry
*To:
Sichuan Yongcongzhong Technology Co., Ltd.
Sichuan Yongcongzhong Technology Co., Ltd.*Content:
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