Advanced HDI PCB Manufacturer for Smart Devices with High Density Interconnect Technology

HDI PCB Technology: 4-layer FR-4 stack-up with 0.3mm minimum hole size for fine-pitch assembly.

Customizable Surface Finish: Options include ENIG, HASL, OSP, and other surface finishing methods.

Flexible Board Thickness: Available thickness ranges from 0.6mm to 4mm to meet various design needs.

Customizable Copper Thickness: Copper thickness can be adjusted from 18um to 175um.

Multiple Solder Mask Colors: Choose from Green, Red, Black, Blue, White, and other custom colors.

Customizable Silkscreen Colors: Available in White, Yellow, Black, and other color options.

Wide Layer Count Range: Supports layer counts ranging from 0 to 40 layers.

OEM and ODM Services: Full customization available from samples, designs, or minor adjustments.

Advanced Manufacturing Capability: Supports multilayer PCB, HDI, high-speed and high-frequency circuit board production for complex electronic applications.

Fast Prototype & Mass Production: Flexible production capacity enables quick turnaround for samples, small batches and large volume PCB orders.