Rigid-Flex Design: Combines mechanical stability with space-saving routing for compact assemblies.
Customizable Colors: Solder mask available in Green, Red, Black, Blue, White; Silkscreen in White, Yellow, Black.
Flexible Dimensions: Board thickness ranges from 0.25mm to 0.6mm; Layer count from 1 to 24.
High Precision Holes: Small hole size as precise as 0.15mm for high-density interconnects.
Multiple Surface Finishes: Options include ENIG, HASL, OSP, ENEPIG, and Gold Finger.
Customization Support: Supports LOGO, color, size, and appearance customization based on client needs.
Flame Retardant: Meets V0 flame retardant properties for enhanced safety.
Low MOQ: Minimum order quantity starts from just 1 piece.