Premium ENIG Finish: Electroless Nickel Immersion Gold ensures excellent solderability and strong oxidation resistance.
High Layer Count: Supports 1 to 50 layers for complex electronic assembly requirements.
Customizable Dimensions: Board thickness ranges from 0.2mm to 6.5mm and copper thickness from 18um to 175um.
Multi-Color Options: Solder mask available in Green, Red, Black, Blue, White, etc. Silkscreen in White, Yellow, Black, etc.
Versatile Surface Finishes: Offers ENIG, ENEPIG, HASL, OSP, and Gold Finger options.
FR-4 Material: Constructed with high-reliability FR-4 fiberglass epoxy for stable electrical performance.
Low Hole Size: Capable of processing small holes as small as 0.3mm.
ISO9001 Certified: Manufacturing process certified under ISO9001:2015 management system.