Rapid Thermal Change Test Chamber for Semiconductor Device Testing

A rapid temperature change chamber achieves temperature changes through continuous linear ramping (e.g. 15C/min) with the sample staying in one chamber. A thermal shock chamber transfers the sample between hot and cold zones instantly (within 15 seconds). The former is for temperature cycling aging and ESS screening, the latter for thermal shock resistance testing.

Standard models support 5C/min, 10C/min, 15C/min, while advanced models can reach 20C/min or even 25C/min. Actual rates depend on temperature range, load size, and refrigeration system configuration.

Through unique air duct design and forced convection circulation, combined with PID self-tuning control algorithm, temperature uniformity is 2C and fluctuation 0.5C. Performance is better under no-load conditions.

Standard with RS232 and RS485 ports, optional Ethernet, USB, and WiFi modules. Real-time temperature curve recording via PC software, data exportable to Excel or PDF, supports remote alarm notification.

Equipped with dual over-temperature protection, compressor overheating and overload protection, high/low pressure protection for refrigeration system, phase failure/reverse protection, earth leakage circuit breaker, emergency stop button. All protections trigger automatic shutdown with audible and visual alarm.