What is the delivery time for non-stock items?

15-20 days depending on quantity.

What operating systems are supported?

Recommended Android 7.1, 8.1, 9.0 and Linux Buildroot/Debian 9/Ubuntu-18.04.

What certifications does the company hold?

ISO9001, ISO13485, ISO14001, IATF16949, UL, CE, RoHS.

Upx-3399 Arm Embedded Mainboard System Development Board Smart Retail Industry Motherboard Customization

Name: Upx-3399 Arm Embedded Mainboard System Development Board Smart Retail Industry Motherboard Customization
Brand: Shenzhen Zhendatech Co., Ltd.
SKU: 2201959975

Guangdong, ChinaShenzhen Zhendatech Co., Ltd.

US$149.90-159.90

1 Piece

Sample price:US$149.00/piece.Request sample

Product profile

Customization

Available

CPU Socket

M.2 Nvme

Form Factor

170mm*105mm

Model NO.

UPX-3399

Operating Temperature

-20℃ to 70℃

Power Supply Type

ATX12V

Storage Interface

M.2

Supported Memory Type

ECC Memory

System Expansion Slot

PCIe x1

Operation System

Recommended Android 5.1.1, Optional Android 6.0

Working Humidity

0%~95%(Non-Condensing)

Main Chipset

Rockchip Rk3588s

Printed Circuit Board

8 Layer

Certificates

UL94V-0+RoHS

Integrated Graphics

Item

Control Board PCBA

Audio Effects

HiFi

Production Type

SMT & DIP & Assembling & Testing

Advantages

PCB Design/Assembly, PCBA & EMS

Inspection

100% IQC, Ipqc, Fqc, QA, Ict

Services

OEM&ODM Manufacturer Since 2005

Transport Package

Inner-Bubble Cotton; Outer-Carton

Specification

Customized

Trademark

Zhenda

Origin

Shenzhen, China

HS Code

8512900000

Production Capacity

1000000PCS/Year

Key features

High-Performance CPU: Rockchip RK3399 with Dual-core A72 and Quad-core A53 up to 1.8GHz.

Flexible Display Support: Dual-screen output with LVDS and EDP interfaces supporting up to 1080P.

Comprehensive Connectivity: Includes USB, RS232/485, Ethernet, WiFi, and Cash Box ports.

Expandable Storage: Supports up to 128GB EMMC and optional 4GB RAM.

OEM/ODM Manufacturer: Established in 2005 with full turnkey PCBA and assembly services.

Multi-OS Support: Compatible with Android 7.1/8.1/9.0 and Linux distributions.

Robust I/O Interfaces: Features GPIO, SPI, I2C, and IR receiver for versatile control.

Company profile

Shenzhen Zhendatech Co., Ltd.

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company, Group CorporationExport Year: 2013-08-01Nearest Port: Shenzhen portAverage Response Time: ≤15hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, FAS, DDP, DAP, CIP, FCA, EXW

AI-Powered supplier vetting

SummaryShenzhen Zhendatech Co., Ltd. is a China-based limited company identified as a trading company, manufacturer/factory, and group corporation. It was established in 2005 and provides PCBA/PCB assembly, cable and wire harness assembly, sheet-metal fabrication, kiosk and order-machine OEM/ODM, product assembly, LED industrial lighting, and related turnkey services. The supplier reports more than 150 employees, over 6,000 square meters of factory space, more than 10 production lines, and annual productivity of 360,000 pieces for its listed product categories. It holds TS 16949, ISO 9001, and QC 080000 certifications. Its stated capabilities include PCB manufacturing up to 64 layers, 0201 component placement, BGA spacing down to 0.3 mm, and SPI, AOI, ICT, FCT, X-ray, RoHS, and aging inspections. The supplier exports to multiple regions and reports cooperation experience with European and North American clients. Evidence is insufficient to assess financial credibility, innovation capability, and specific...

Supplier typeThe supplier is explicitly classified as a trading company, manufacturer/factory, and group corporation, with a limited-company ownership structure. This indicates a mixed manufacturing and trading profile rather than a purely commercial intermediary.

CertificationsThe supplier reports holding TS 16949, ISO 9001, and QC 080000 management-system certifications. These certifications provide explicit evidence of formal quality, automotive-related quality, and hazardous-substance management systems.

After-Sales capabilityThe supplier states that it has warehouses in Hong Kong, Europe, and North America, can prepare boards near customers, and can provide Kanban service according to customer requirements. It also offers testing, final assembly, conformal coating, and peripheral-product support, but the slices do not describe a formal warranty or complaint-resolution policy.

R&D capabilityThe supplier offers electronic product design as part of its turnkey services and reports technical PCB capabilities including up to 64 layers, 0201 placement, and 0.3 mm BGA spacing. These facts demonstrate engineering and process capability, but they do not establish a broader record of proprietary innovation or new-product development.

Production capacityThe supplier reports more than 10 production lines, over 150 employees, a factory exceeding 6,000 square meters, 360,000 pieces of annual productivity for its listed categories, and order fulfillment within 15 working days in both peak and off-peak seasons. Its stated inspection coverage includes SPI, AOI, ICT, FCT, X-ray, RoHS, and aging, supporting a substantial production and quality-control capability.

Customization capabilityThe supplier provides PCB assembly across SMT, DIP, MI, and AI processes, component procurement, product final assembly, testing, conformal coating, electronic product design, sheet-metal fabrication, cable and wire harness assembly, and kiosk/order-machine OEM/ODM. This broad turnkey and OEM/ODM offering is explicit evidence of customization capability across multiple product stages.

Client casesThe supplier states that it has 10 years of cooperation experience with European and North American clients and mentions companies such as Xilinx, TI, Avnet, and Future. However, the slices do not specify project scope, order history, references, or independently verifiable case details, so the evidence supports customer exposure but not a fully documented case record.