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8-Inch Wafer-Based Silicon Microfluidic Chip with High Aspect Ratio Structures
US$199.90
10 Pieces
Sample price:US$199.90/piece.Request sample

Product profile

Customization

Available

Certification

CE, ISO

Application

Rubber, Plastic, Chemical, Ceramic, Glass

Material

Silicon Dioxide,Sin,

Model

Customized

Breadth Depth Ratio

Customized

Accuracy

8in

Transport Package

Carton Packaging

Specification

Customized

Trademark

ZEGOTA

Origin

China

HS Code

8542399000

Production Capacity

100000 PCS/Month

Key features

High Aspect Ratio Structures: Features high precision 3D channels and chambers fabricated via deep silicon etching.
Customizable Model and Ratio: Model and Breadth Depth Ratio are explicitly customizable to meet specific design needs.
Superior Chemical Stability: Silicon substrate offers excellent resistance to corrosion, high temperature, and pressure.
Semiconductor Grade Precision: Utilizes photolithography and wafer bonding for nano-to-micro structure fabrication.
Biocompatible for Implants: Suitable for long-term implantable bio-monitoring and drug delivery systems.
Mass Production Capability: Supports large-scale wafer-level processing for cost-effective batch production.
Multi-Functional Integration: Supports integration of sensors, electrodes, and other functional components.
CE and ISO Certified: Product meets CE and ISO certification standards for quality and safety.

Company profile

Zhejiang Zegota Precision Technology Co., Ltd.
Importers and ExportersHigh Repeat Buyers ChoiceExperienced TeamFast Delivery
CertifiedBusiness Type: Trading Company CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 6 yeras CertifiedNearest Port: Shanghai Port, Ningbo PortAverage Response Time: ≤1.55h CertifiedTerms of Payment: LC, T/T, PayPal, etc.

AI-Powered supplier vetting

SummaryThe supplier operates in machinery, metal materials, metal-forming machine tools, automation equipment, and related product sales. It reports one production line, 3 years of total R&D engineer experience, 6–10 quality-control staff, and one-month lead times in both peak and off-peak periods. Customization is offered in several forms, including sample-, design-, full-, minor-, and flexible customization. However, the supplier is explicitly not classified as a professional technical supplier, does not provide 3D design, ODM, SDK, or famous-brand OEM services, and had no new product in the past year. Service-management procedures, corrective-action records, complaint-handling procedures, overseas service infrastructure, and offline trade-show participation are not evidenced or are explicitly absent. Certification is listed only as “Others,” without a specific certification identified.
Supplier typeThe supplier’s stated scope covers technology promotion, machinery and mechanical-part sales, metal materials, metal-forming machine tools, industrial automation devices, protective products, alloys, synthetic materials, and medical devices. It is explicitly identified as not being a professional technical supplier, indicating a broad equipment and industrial-product trading/sales profile rather than a specialized technical-service provider.
R&D capabilityThe supplier reports 3 years of total R&D engineer experience and describes technical research and an R&D department. Nevertheless, it had no new product in the past year, does not provide ODM or SDK services, does not offer 3D software design, and is not identified as a professional technical supplier; these explicit limitations prevent a positive innovation assessment.
Production capacityThe supplier reports one production line, 6–10 quality-control staff, one-month peak and off-peak lead times, and production information referring to 200 cold rolling mill machines. Its descriptions also mention large production capacity, inspection methods, rolling-mill manufacturing experience since 1985, and equipment hoisting capacity up to 300 tons. These records support established rolling-mill production capability, although the specific output information is limited.
Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. This is direct evidence of a broad range of customization services.

Product Q&A

Q:What is the chip size and accuracy?
A:
The chip is an 8-inch wafer-based silicon microfluidic chip with an accuracy of 8 inches.
Q:Can the chip model and dimensions be customized?
A:
Yes, the Model and Breadth Depth Ratio are explicitly customizable to suit specific application requirements.
Q:What materials are used for the chip?
A:
The primary material is Silicon Dioxide and Silicon (Sin), offering high thermal conductivity and chemical corrosion resistance.
Q:What are the main applications of this chip?
A:
It is suitable for medical diagnostics, pharmaceutical synthesis, implantable devices, and harsh biochemical environments.
Q:What manufacturing processes are employed?
A:
We use mature semiconductor techniques including photolithography, deep silicon etching, and wafer bonding.

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