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Back Grinding Wheels for Silicon Wafers Thinning
US$2,500.00
1-4 Pieces
US$2,000.00
5-9 Pieces
US$1,500.00
10+ Pieces
Sample price:US$2000.00/piece.Request sample

Product profile

Customization

Available

Type

Thinning

Material

Diamond Abrasive

Model NO.

Silicon wafer wheel

Application

Silicon Wafer Back

Effect

Polishing

Grit Size (JIS)

80#---1000#

Shape

Cylindrical

Warranty

1 Years

Service

7 Days/24 Hours

Feature

Long Life

Grinding Material

Cubic Boron Carbide

Customized Support

OEM, ODM

Bonding Agent

Vitrified & Resin

Product Name

Diamond Grinding Wheel

Package

Wooden Box

Wheel Type

Angle Grinding Wheels

Bond

Vitrified & Resin

Wheel Base

Steel or Aluminium

Transport Package

Wooden Boxes

Specification

JB

Trademark

HT

Origin

Henan, China

Production Capacity

10000 Piece/Pieces Per Month

Key features

High Cost Performance: Excellent grinding performance with high cost efficiency for semiconductor wafer thinning.
Global Machine Compatibility: Stably compatible with grinding machines from Europe, America, Japan, and China.
Customizable Grit Size: Grit size is customizable within the range of 80# to 1000# (JIS standard).
OEM and ODM Support: Full OEM and ODM customization services are available for tailored solutions.
Long Service Life: Designed for durability with a long life feature for continuous industrial use.
Flexible Customization: Offers flexible customization options including size and shape to meet specific needs.
Professional QA/QC: 100% inspection for finished products including visual and function checks by 30 inspectors.
Fast Lead Time: Off-season lead time is within 15 workdays, ensuring quick delivery for urgent orders.

Company profile

Zhengzhou Hongtuo Precision Tools Co., Ltd.
Importers and ExportersHigh Repeat Buyers ChoiceYears of Export Experience
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 10 Years CertifiedNearest Port: Qingdao PortAverage Response Time: ≤5.01h

AI-Powered supplier vetting

SummaryThe supplier is a combined limited company with 296 employees and capabilities spanning lathe, CNC processing, cutting, pressing, and sintering. It reports ISO 9001:2000 certification obtained in 2006, high-tech enterprise and high-tech product certifications, quality assurance procedures, and documented complaint and corrective-action processes. Product development is supported by new products in the past year, ODM services, OEM services for well-known brands, and flexible customization, but no SDK is available. Manufacturing capacity is supported by inventory capability and multiple facilities, although there is no valid manufacturing-capacity contract with related subcontractors. International service coverage is limited: no overseas agents, branches, warehouse, showroom, or listed overseas service countries. The supplier has participated in CIMES and reports established export experience, while customer-specific case details are limited.
Supplier typeThe supplier is identified as a combined company and a limited company, with no larger-company-group affiliation reported. Its stated product scope includes honing tools and grinding wheels, and it employs 296 people.
CertificationsThe company reports ISO 9001:2000 certification obtained in 2006, along with high-tech enterprise and high-tech product certifications from the Henan Provincial Department of Science and Technology. It also reports quality assurance in quality-control processes.
After-Sales capabilityThe supplier has documented and followed procedures for corrective and preventive actions, customer complaints, and service-capability assessment, and it offers inventory capability and multiple quotation and payment options. However, it reports no overseas warehouse, showroom, agents, or branches, so overseas after-sales coverage is limited.
R&D capabilityThe supplier reports new products during the past year, provides ODM services, and has OEM capability for well-known brands. Its reported high-tech enterprise and product certifications support technical orientation, but no SDK is available.
Production capacityProduction resources include lathe, CNC processing, cutting, pressing, and sintering facilities, with finished-product inspection instructions that are uniformly followed. The supplier reports inventory capability, 20 qualified service-capability suppliers, and lead times of one month in peak season and within 15 working days off-season; however, it lacks a valid manufacturing-capacity contract with related subcontractors.
Customization capabilityThe supplier explicitly reports flexible customization and provides ODM and OEM services, including OEM services for well-known brands. These statements directly support its ability to develop or adapt products for customer requirements.
Client casesThe supplier reports OEM service for well-known brands, products used in automotive, motorcycle-engine, aircraft, hydraulic-cylinder, sewing-machine-accessory, bearing, and semiconductor microelectronics industries, and participation in the CIMES offline trade show. Specific customer names, project details, or verifiable case studies are not provided.

Product Q&A

Q:What is the main application of these grinding wheels?
A:
They are mainly used for thinning and fine grinding of semiconductor silicon wafers.
Q:What grit sizes are available for customization?
A:
The grit size can be customized within the range of 80# to 1000# according to JIS standards.
Q:Is OEM and ODM service supported?
A:
Yes, we support both OEM and ODM services to provide flexible customization options.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 piece.
Q:What are the payment terms accepted?
A:
We accept LC, T/T, PayPal, and Western Union as payment terms.

Send Inquiry

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