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Good Performance Silicon Wafer Back Thinning Wheel Grinding Wheel
US$2,300.00
1-4 Pieces
US$2,000.00
5-9 Pieces
US$1,600.00
10+ Pieces
Sample price:US$1500.00/piece.Request sample
Product profile
Customization
AvailableType
ThinningMaterial
Diamond AbrasiveApplication
Silicon Wafer BackEffect
PolishingGrit Size (JIS)
80#---1000#Shape
CylindricalWarranty
1 YearsService
7 Days/24 HoursFeature
Long LifeGrinding Material
Cubic Boron CarbideCustomized Support
OEM, ODMBonding Agent
Vitrified & ResinProduct Name
Diamond Grinding WheelPackage
Wooden BoxWheel Type
Angle Grinding WheelsBond
Vitrified & ResinWheel Base
Steel or AluminiumTransport Package
Wooden BoxesSpecification
JBTrademark
HTOrigin
Henan, ChinaProduction Capacity
10000 Piece/Pieces Per MonthKey features
High Cost Performance: Excellent grinding performance with high cost efficiency for semiconductor wafer thinning.
Global Compatibility: Stably used in grinding machines from Europe, America, Japan, and China; replaces imported products.
Customizable Grit Size: Grit size ranges from 80# to 1000# (JIS) to meet specific thinning and polishing needs.
Long Service Life: Diamond abrasive material ensures long life and durable performance during silicon wafer processing.
Flexible OEM/ODM Support: Supports OEM and ODM customization for shape, size, and bonding agent (Vitrified & Resin).
100% Quality Inspection: Finished products undergo 100% visual and function inspection by 30 QA/QC inspectors.
Fast Lead Time: Off-season lead time within 15 workdays; peak season lead time is one month.
24/7 Technical Service: Provides 7 days/24 hours service support for customer inquiries and technical assistance.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 10 Years CertifiedNearest Port: Qingdao PortAverage Response Time: ≤4.86h
AI-Powered supplier vetting
SummaryThe supplier is a combined limited company with 296 employees and capabilities spanning lathe, CNC processing, cutting, pressing, and sintering. It reports ISO 9001:2000 certification obtained in 2006, high-tech enterprise and high-tech product certifications, quality assurance procedures, and documented complaint and corrective-action processes. Product development is supported by new products in the past year, ODM services, OEM services for well-known brands, and flexible customization, but no SDK is available. Manufacturing capacity is supported by inventory capability and multiple facilities, although there is no valid manufacturing-capacity contract with related subcontractors. International service coverage is limited: no overseas agents, branches, warehouse, showroom, or listed overseas service countries. The supplier has participated in CIMES and reports established export experience, while customer-specific case details are limited.
Supplier typeThe supplier is identified as a combined company and a limited company, with no larger-company-group affiliation reported. Its stated product scope includes honing tools and grinding wheels, and it employs 296 people.
CertificationsThe company reports ISO 9001:2000 certification obtained in 2006, along with high-tech enterprise and high-tech product certifications from the Henan Provincial Department of Science and Technology. It also reports quality assurance in quality-control processes.
After-Sales capabilityThe supplier has documented and followed procedures for corrective and preventive actions, customer complaints, and service-capability assessment, and it offers inventory capability and multiple quotation and payment options. However, it reports no overseas warehouse, showroom, agents, or branches, so overseas after-sales coverage is limited.
R&D capabilityThe supplier reports new products during the past year, provides ODM services, and has OEM capability for well-known brands. Its reported high-tech enterprise and product certifications support technical orientation, but no SDK is available.
Production capacityProduction resources include lathe, CNC processing, cutting, pressing, and sintering facilities, with finished-product inspection instructions that are uniformly followed. The supplier reports inventory capability, 20 qualified service-capability suppliers, and lead times of one month in peak season and within 15 working days off-season; however, it lacks a valid manufacturing-capacity contract with related subcontractors.
Customization capabilityThe supplier explicitly reports flexible customization and provides ODM and OEM services, including OEM services for well-known brands. These statements directly support its ability to develop or adapt products for customer requirements.
Client casesThe supplier reports OEM service for well-known brands, products used in automotive, motorcycle-engine, aircraft, hydraulic-cylinder, sewing-machine-accessory, bearing, and semiconductor microelectronics industries, and participation in the CIMES offline trade show. Specific customer names, project details, or verifiable case studies are not provided.
Product Q&A
Q:What is the primary application of this grinding wheel?
A:
It is mainly used for thinning and fine grinding of semiconductor silicon wafers.
Q:Is OEM and ODM service available?
A:
Yes, we support OEM and ODM customization, including flexible options for shape, size, and bonding agent.
Q:What is the warranty period for this product?
A:
We provide a 1-year warranty for this diamond grinding wheel.
Q:What are the available grit size options?
A:
The grit size (JIS) can be customized from 80# to 1000#.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 1 piece.
Send Inquiry
*To:
Zhengzhou Hongtuo Precision Tools Co., Ltd.
Zhengzhou Hongtuo Precision Tools Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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