When sourcing, specify the Base Material (FR-4 is standard), Board Thickness (0.8mm to 1.6mm is common), and Surface Finish (HASL, ENIG, or OSP). ENIG (Electroless Nickel Immersion Gold) is recommended for boards requiring high flatness or fine-pitch components. Ensure the Via design meets your current requirements, and confirm the TG (Glass Transition Temperature) rating; High-TG (170°C+) is necessary for products operating in high-heat environments. Additionally, check the Hole Size Tolerance to ensure compatibility with automated component insertion.