When sourcing bimetal strips, you must prioritize the bonding strength between the copper alloy and the backing material (usually steel or another copper grade). Ensure the interface bonding rate is ≥99.9% to prevent delamination under thermal stress. Key parameters include electrical conductivity (IACS%), thermal expansion coefficients, and mechanical hardness (HV/HB). For electrical applications, verify the alloy composition (e.g., CuSn, CuPb, or CuAl) to ensure it meets your specific conductivity and wear-resistance requirements.