Buyers must evaluate several key parameters: Wafer Thickness, where the industry is moving toward thinner slices (e.g., 130μm to 150μm) to reduce silicon costs without compromising structural integrity; Oxygen and Carbon content, which should be minimized to prevent defects; and Resistivity uniformity, which ensures consistent cell performance. Additionally, the size standard (M10 - 182mm or G12 - 210mm) is critical, as larger wafers increase power output per panel but require compatible manufacturing equipment.