Buyers must evaluate the Architecture (e.g., Hopper, Ada Lovelace, Ampere) to ensure it meets the intended application's processing requirements. Key metrics include CUDA Core count, Tensor Cores for AI workloads, and VRAM capacity/type (e.g., HBM3, GDDR6X). Additionally, confirm the Thermal Design Power (TDP) and physical dimensions to ensure compatibility with existing PCB designs and cooling solutions. For wholesale integration, verify the PCIe interface version (e.g., Gen 5.0) to prevent data bottlenecks.