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Nvidia h200

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Product Attributes:
Integrated Graphics Card
PCI Express 3.0 16X
Output Type: HDMI
Chip: nVIDIA
Memory Bus: 512 Bit
Usage: Computer
Certification: ISO
Condition: New
Bus Standard: PCI-E 16X
Video Memory Capacity: ≥2GB
Heat Dispatch Method: Fan HeatSink
Application: Enterprise Level
Max. CPUs: 2
Server Form Factor: 2U
Storage Capacity: >1TB
Supporting Memory Capacity: >1TB
System Architecture: X86 Server
Form Factor: 2U
Management Interface: IPMI
Operating System: Windows Server
Power Supply: Redundant PSU
Processor Type: Intel Xeon
Storage Type: NVMe
Instruction System: RISC
Number of CPu Threads: 4
Network Connectivity: 25GbE
RAM Capacity: 128GB
Dedicated Graphics Card
Usage: Workstation
Usage: Server
Usage: Telephone
Usage: Mobile phone
Usage: Laptop
Certification: CE
Certification: RoHS
Application: Department Level
Max. CPUs: 1
Server Form Factor: 4U
Server Form Factor: 1U
Storage Capacity: 500-1000GB
Storage Capacity: 320-499GB
Storage Capacity: < 320GB
Supporting Memory Capacity: ≤8GB
Supporting Memory Capacity: 64GB
Supporting Memory Capacity: 128GB
Supporting Memory Capacity: 12GB
System Architecture: Non-X86 Server
Form Factor: 8U
Form Factor: 4U
Form Factor: 1U
Management Interface: iDRAC
Management Interface: BMC
Operating System: Linux
Operating System: VMware
Power Supply: Single PSU
Processor Type: AMD EPYC
Storage Type: HDD
Storage Type: SSD
Hybrid Storage(Combination of HDDs and SSDs)
Instruction System: CISC
Number of CPu Threads: 8
Network Connectivity: 100GbE
Network Connectivity: 1GbE
Network Connectivity: 10GbE
Network Connectivity: 40GbE
RAM Capacity: 32GB
RAM Capacity: 16GB

Sourcing guidance for Nvidia H200

What are the key technical specifications that distinguish the Nvidia H200 from its predecessors?

The Nvidia H200 is the first GPU to utilize HBM3e memory, providing 141GB of capacity and a massive 4.8TB/s of memory bandwidth. This represents a nearly double increase in bandwidth compared to the H100, which is critical for Large Language Model (LLM) inference and handling massive datasets in generative AI applications.

How should buyers evaluate the compatibility and integration of H200 modules into existing data centers?

The H200 is designed to be form-factor compatible with H100 systems, meaning it can be integrated into HGX H200 server boards using the same power and thermal envelopes. Buyers must ensure their infrastructure supports PCIe Gen5 and NVLink 4.0 to leverage the full 900GB/s GPU-to-GPU interconnect speed.

What compliance and regulatory standards are essential for high-end AI hardware procurement?

Procurement must adhere to CE, FCC, and UL certifications for hardware safety. Crucially, for cross-border trade, buyers must verify compliance with Export Administration Regulations (EAR) and specific high-tech trade restrictions that govern the transfer of advanced computing chips to certain jurisdictions.

What are the power and cooling requirements for maintaining H200 performance?

The H200 has a Thermal Design Power (TDP) of up to 700W per GPU. Professional buyers must ensure their data centers are equipped with advanced liquid cooling or high-airflow precision air cooling to prevent thermal throttling and ensure a long operational lifespan for these high-value assets.

Cross-Border Procurement Risks and Strategic Advice for Nvidia H200

How can buyers mitigate the risk of counterfeit or refurbished hardware?

Always request original factory inspection reports and verify the Serial Numbers (SN) with the manufacturer's database. For high-value AI chips, use third-party inspection services to conduct a physical 'chip-on-board' verification before final payment, and prioritize suppliers on Made-in-China.com who offer Trade Assurance.

What is the most effective negotiation strategy for bulk GPU procurement?

Focus on Total Cost of Ownership (TCO) rather than just the unit price. Negotiate for extended hardware warranties (3-5 years), bundled technical support hours, and guaranteed lead times. Given the volatility of AI chip markets, securing a fixed-price contract with a 30% deposit is a common strategy to hedge against price spikes.

What international trade policies should be monitored for H200 imports?

Buyers must stay updated on semiconductor export controls and tariff classifications (HS Code 8471.80). It is vital to work with a customs broker experienced in dual-use technology to ensure all End-User Statements are accurately filed, preventing legal complications or shipment seizures at the border.

What are the recommended shipping and insurance practices for high-value electronics?

Due to the extreme sensitivity and high value of H200 units, use specialized white-glove air freight with shock-absorbent packaging and GPS tracking. Ensure the shipment is covered by All-Risk Marine Insurance at 110% of the invoice value to protect against theft, damage, or loss during transit.

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