Is after-sales service available?

Yes, after-sales service is available for this product.

What payment methods are accepted?

We accept LC, T/T, D/P, PayPal, Western Union, Small-amount payment, and Money Gram.

IC Wafer Cleaning Machine for Semiconductor Manufacturing

Name: IC Wafer Cleaning Machine for Semiconductor Manufacturing
Brand: Nanjing Bangwin Thermal Equipment Co., Ltd.
SKU: 2291103265

Jiangsu, ChinaNanjing Bangwin Thermal Equipment Co., Ltd.

US$7,000.00

1-2 Pieces

US$6,500.00

3+ Pieces

Product profile

Customization

Available

After-sales Service

Available

Warranty

1 Year

Model NO.

Temperature Control Range

20-95°C

Ultrasonic Cleaning Frequency

28kHz/40kHz

Heating Power

1.5-36 Kw

Capacity

38-1500ml

Transport Package

Custom

Specification

500*300*250mm

Trademark

N/A

Origin

China

Key features

Multi-stage Cleaning Process: Removes micron particles, metal ions, and organic matter using ultrasonic waves, acid/alkali washing, and rinsing.

Automated PLC Control: Flexible adjustment of temperature, time, and power for different silicon material types.

Energy-Saving Design: Overflow circulation filtration reduces water consumption; water-based agents replace chemical solvents.

Flexible Ultrasonic Frequency: Options available at 28kHz or 40kHz to suit specific cleaning needs.

High Capacity Options: Scalable capacity ranging from 38ml to 1500ml for diverse production scales.

1-Year Warranty: Comprehensive 1-year warranty coverage for machine reliability.

Available After-Sales Service: Professional support services available for all purchased units.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExperienced Team

Nanjing Bangwin Thermal Equipment Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.11hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

AI-Powered supplier vetting

SummaryNanjing Bangwin Thermal Equipment Co., Ltd. is described as a limited-company manufacturer of plate, shell-and-tube, plate-fin, tubular, and finned-tube heat exchangers, with stated R&D, design, production, and sales activities. It offers multiple forms of customization and has technical personnel supporting customer-request confirmation, product design, production, and after-sales service. However, the supplier reports only one R&D engineer, no new products launched in the past year, no ODM or SDK capability, and no OEM service for popular brands. Quality traceability, quality assurance, environmental compliance, and fire-drill status are unknown. It has no overseas warehouse, showroom, agent or branch, and has not participated in offline trade shows. Service procedures exist but have no records, while complaint handling and corrective-action mechanisms are not clearly defined.

Supplier typeThe supplier is identified as Nanjing Bangwin Thermal Equipment Co., Ltd., a professional manufacturer integrating R&D, design, production, and sales. Its stated product scope covers several heat-exchanger types, and it is organized as a limited company with four employees and an affiliated company.

R&D capabilityThe supplier reports one R&D engineer and describes technical responsibilities covering customer-request confirmation, new-product design, and technical support. Nevertheless, it launched no new products in the past year, has no available SDK, does not provide ODM services, and only generally describes a professional technical innovation team.

Production capacityThe company is described as a manufacturer with production activity covering multiple heat-exchanger categories. However, the stated quantity and size of quality-control test equipment is zero, and no production capacity, facility scale, or output data are provided; this creates an explicit quality-control equipment deficiency while leaving overall production scale unverified.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. These stated services directly support a broad customization capability.