What are the available ultrasonic frequencies?

The machine offers 28kHz and 40kHz ultrasonic cleaning frequencies.

What payment methods are accepted?

Accepted methods include LC, T/T, D/P, PayPal, Western Union, Money Gram, and small-amount payments.

Silicon Wafer Cleaning Machine for Semiconductor Fab

Name: Silicon Wafer Cleaning Machine for Semiconductor Fab
Brand: Nanjing Bangwin Thermal Equipment Co., Ltd.
SKU: 2290947085

Jiangsu, ChinaNanjing Bangwin Thermal Equipment Co., Ltd.

US$7,000.00

1-2 Pieces

US$6,500.00

3+ Pieces

Product profile

Customization

Available

After-sales Service

Available

Warranty

1 Year

Model NO.

Temperature Control Range

20-95°C

Ultrasonic Cleaning Frequency

28kHz/40kHz

Heating Power

1.5-36 Kw

Capacity

38-1500ml

Transport Package

Custom

Specification

500*300*250mm

Trademark

N/A

Origin

China

Key features

Multi-stage Cleaning Process: Removes micron particles, metal ions, and organic matter using ultrasonic, acid, alkaline, and rinsing steps.

Automated PLC Control: Flexible adjustment of temperature, time, and power for monocrystalline and polycrystalline silicon materials.

Energy-Saving Design: Overflow circulation filtration reduces water consumption and uses water-based agents instead of solvents.

Dual Frequency Options: Available in 28kHz and 40kHz ultrasonic cleaning frequencies.

Flexible Capacity: Supports processing volumes ranging from 38ml to 1500ml.

1-Year Warranty: Comprehensive coverage for mechanical defects and parts for one year.

Fast Lead Time: Production completed within 15 workdays during both peak and off-peak seasons.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExperienced Team

Nanjing Bangwin Thermal Equipment Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.34hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

AI-Powered supplier vetting

SummaryNanjing Bangwin Thermal Equipment Co., Ltd. is described as a limited-company manufacturer of plate, shell-and-tube, plate-fin, tubular, and finned-tube heat exchangers, with stated R&D, design, production, and sales activities. It offers multiple forms of customization and has technical personnel supporting customer-request confirmation, product design, production, and after-sales service. However, the supplier reports only one R&D engineer, no new products launched in the past year, no ODM or SDK capability, and no OEM service for popular brands. Quality traceability, quality assurance, environmental compliance, and fire-drill status are unknown. It has no overseas warehouse, showroom, agent or branch, and has not participated in offline trade shows. Service procedures exist but have no records, while complaint handling and corrective-action mechanisms are not clearly defined.

Supplier typeThe supplier is identified as Nanjing Bangwin Thermal Equipment Co., Ltd., a professional manufacturer integrating R&D, design, production, and sales. Its stated product scope covers several heat-exchanger types, and it is organized as a limited company with four employees and an affiliated company.

R&D capabilityThe supplier reports one R&D engineer and describes technical responsibilities covering customer-request confirmation, new-product design, and technical support. Nevertheless, it launched no new products in the past year, has no available SDK, does not provide ODM services, and only generally describes a professional technical innovation team.

Production capacityThe company is described as a manufacturer with production activity covering multiple heat-exchanger categories. However, the stated quantity and size of quality-control test equipment is zero, and no production capacity, facility scale, or output data are provided; this creates an explicit quality-control equipment deficiency while leaving overall production scale unverified.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. These stated services directly support a broad customization capability.