Tmm13I Printed Circuit Board 2-Layer PCB for RF/Microwave Electronics

Name: Tmm13I Printed Circuit Board 2-Layer PCB for RF/Microwave Electronics
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1968910161

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$0.90-99.99

1 Piece

Sample price:US$0.90/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

Tmm13I

Model NO.

BIC-1190-V3.0

Material

Rogers Tmm13I Laminate

Application

High-Frequency RF Systems

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Enig

Base Material

Rogers Tmm13I Laminate

Insulation Materials

Tmm13I Substrate

Brand

Rogers

Board Types

Rigid PCB

Test

100% Electrical Test Prior Shipment

Type of Artwork to Be Supplied

Email File, Gerber RS-274-X, PCB.Doc etc

Service Area

Worldwide, Globally

Transport Package

Shipping Vacuum Packaging

Specification

90mm × 65mm (± 0.15mm)

Trademark

bicheng

Origin

Shenzhen China

HS Code

8534009000

Production Capacity

360000 Square Meters/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.38h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.