Is the structure customizable?

Yes, Tantalum film and haite alloy C structures are optional.

What is the response time of the sensor?

The response time is less than or equal to 1ms (rise to 90% FS).

Bnpc20 Pressure Core/ Pressure Sensor with Platinum Resistance

Name: Bnpc20 Pressure Core/ Pressure Sensor with Platinum Resistance
Brand: BNSENS Co., Ltd.
SKU: 2149833185

Jiangsu, ChinaBNSENS Co., Ltd.

US$10.00-69.00

1 Piece

Sample price:US$15.00/piece.Request sample

Product profile

Customization

Available

Type

Piezoresistive Pressure Sensor

Component

SemiConductor Type

Model NO.

BNPC20

For

Diffused Silicon Pressure Transmitter

Output Signal Type

Analog Type

Material

Stainless Steel

Scale Range

-100kpa~0~10kpa…100MPa

Temperature Measurement

-50~125℃

Pressure Type

Gauge Pressure, Absolute Pressure, Sealing Pressur

Bridge Resistance

3KΩ~6KΩ

Electrical Connections

Silica Gel Flexible Conductor

Power Supply

Current: 1.5mA; Voltage: 10V

Key features

Integrated Temp & Pressure: Synchronous measurement of pressure and temperature with platinum resistance.

316L Stainless Steel: Constructed with 316L stainless steel diaphragm and shell for durability.

High Reliability Chip: Features high-reliable imported pressure chip for stable performance.

Wide Temp Compensation: Wide temperature compensation range with constant current power supply.

Moisture Resistance: Compensation board irrigation glue provides excellent moisture resistance.

Compact Design: Small volume, easy to install and use for various applications.

18-Month Warranty: Comprehensive 18-month warranty period for peace of mind.

Optional Structures: Tantalum film and haite alloy C structures are available as options.

Company profile

Importers and ExportersFast DeliveryQuality Assurance100% Finished Products Inspection

BNSENS Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryAverage Response Time: ≤2.58h

AI-Powered supplier vetting

SummaryBNSENS Co., Ltd. is identified as a Chinese manufacturer/factory in Jiangsu specializing in sensors and transmitters for pressure, level, temperature, flow, current, switching, and position applications. The supplier describes MEMS and independently developed ASIC expertise, a U.S.-based R&D center, and supply or cooperation relationships involving Emerson, SICK, TSMC, Siemens, Infineon, and Rohm. Its products are reported as serving multiple industrial sectors, and an audit was conducted by BV; however, the audit result and type are provided only as codes, so certification or compliance conclusions cannot be made. Information on after-sales service, financial credibility, quality systems, customization, sustainability, and several R&D services is insufficient. The stated registered capital is omitted from this assessment for privacy.

Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a high-tech enterprise specializing in sensor development, manufacturing, and trade. Its stated business scope is Electrical & Electronics, and its listed products cover multiple sensor and transmitter categories.

R&D capabilityBNSENS describes a sensor R&D center in Minnesota, core MEMS-chip technology, independently developed ASIC chips, German-origin production-line introduction, and development of additional industrial-control sensors. These statements provide explicit evidence of R&D and technology activity, although the scope and verification of the capabilities are not further documented.

Production capacityThe supplier is classified as a factory and states that it develops and manufactures a broad range of sensor products. Its history includes a sensor production-line introduction and factory relocation, while reported use across oil, gas, power, chemical, metallurgy, food, environmental protection, aerospace, and municipal applications supports production experience; actual capacity, equipment scale, and output data are not provided.

Client casesThe supplier reports that its products are used across numerous industries and cites relationships or sales involving Emerson, SICK, TSMC, Siemens in Vietnam, Infineon, and Rohm. These are explicit customer or business-cooperation claims, but the slices do not provide project details, order scope, duration, or independently verified case evidence.