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Sapphire and Wafer Components Kizi Vertical High Precision Thinning and Lapping Machine
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableWarranty
2 YearsType
Surface Grinding MachineModel NO.
KJ360LProcessing Object
Sapphire&Wafer&CeramicAbrasives
Grinding WheelControlling Mode
NormalAutomatic Grade
SemiautomaticPrecision
High PrecisionCertification
ISO 9001Condition
NewMax. Thinning Diameter
300mmGrinding Wheel Motor Speed
0-2000rpmWorkpiece Motor Speed
0-300rpmAir Pressure
0.6 MPaFeed Rate
0.1um-1000um/SecOptimal Flatness
0.001mmWeight
1800kgAfter-Sales Service Provided
Engineers Available to Service Machinery OverseasTransport Package
Standard Export PackingSpecification
980*1620*2390mmTrademark
KiziOrigin
ChinaCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2016-07-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.72h CertifiedTerms of Payment: T/T
About Our Factory & Business Background
AddressNo. 7, Dangkeng Road, The 3rd Industrial Zone of Shangtun, Liaobu Town,Dongguan, Guangdong, China
Plant Area6809 square meters
Number of Employees47
Registered Capital5,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsLapping And Polishing Machine
Production MachinesMilling Facility
R&D Engineers8 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2010-01-12
Main MarketsEurope, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic
Number of Foreign Trading Staff8
Overseas Agent/BranchNo
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