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Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
US$49,999.00-59,999.00
1 Piece
Product profile
Customization
AvailableType
Surface Grinding MachineProcessing Object
Metal&NonmetalModel NO.
KJ200WAbrasives
Grinding DiscControlling Mode
NormalAutomatic Grade
SemiautomaticPrecision
High PrecisionCertification
ISO 9001, SGSCondition
NewMax. Grinding Diameter
200mmDiamond Grinding Wheel Size
200mmRevolving Speed
0-800 RpmPower
0.75kwWeight
1100kgAfter-Sales Service Provided
Engineers Available to Service Machinery OverseasWorkpiece Accuracy Control(Parallelism)
0.001mmTransport Package
Standard Export PackingSpecification
1350*600*1600mmTrademark
KiziOrigin
ChinaCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2016-07-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.72h CertifiedTerms of Payment: T/T
About Our Factory & Business Background
AddressNo. 7, Dangkeng Road, The 3rd Industrial Zone of Shangtun, Liaobu Town,Dongguan, Guangdong, China
Plant Area6809 square meters
Number of Employees47
Registered Capital5,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsLapping And Polishing Machine
Production MachinesMilling Facility
R&D Engineers8 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2010-01-12
Main MarketsEurope, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic
Number of Foreign Trading Staff8
Overseas Agent/BranchNo
Send Inquiry
*To:Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.
Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.*Content:
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