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Wafer and Sapphire Materials Vertical High Precision Thinning and Lapping Machine
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableWarranty
2 YearsType
Surface Grinding MachineModel NO.
KJ360LProcessing Object
Sapphire&Wafer&CeramicAbrasives
Grinding WheelControlling Mode
NormalAutomatic Grade
SemiautomaticPrecision
High PrecisionCertification
ISO 9001Condition
NewMax. Thinning Diameter
300mmGrinding Wheel Motor Speed
0-2000rpmWorkpiece Motor Speed
0-300rpmFeed Rate
0.1um-1000um/SecOptimal Flatness
0.001mmAfter-Sales Service Provided
Engineers Available to Service Machinery OverseasTransport Package
Standard Export PackingSpecification
980*1620*2390mmTrademark
KiziOrigin
ChinaKey features
High Precision Thinning: Achieves optimal flatness of 0.001mm for silicon wafers, sapphire, and ceramics.
Advanced Control System: Auto-compensates wheel wear and adjusts speed to prevent workpiece deformation.
Online Thickness Measurement: Equipped with on-line device for real-time monitoring during grinding.
Constant Temperature Cooling: Ensures stable machining precision through a dedicated cooling system.
Overseas Technical Support: Engineers available to service machinery at customer locations overseas.
ISO 9001 Certified: Manufacturing process meets international quality management standards.
Customizable Specifications: ODM and OEM services available with customizable max thinning diameter.
Versatile Material Processing: Suitable for brittle and rigid materials like glass, quartz, and compound semiconductors.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2016-07-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.57h CertifiedTerms of Payment: T/T
About Our Factory & Business Background
AddressNo. 7, Dangkeng Road, The 3rd Industrial Zone of Shangtun, Liaobu Town,Dongguan, Guangdong, China
Plant Area6809 square meters
Number of Employees47
Registered Capital5,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsLapping And Polishing Machine
Production MachinesMilling Facility
R&D Engineers8 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2010-01-12
Main MarketsEurope, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic
Number of Foreign Trading Staff8
Overseas Agent/BranchNo
Product Q&A
Q:Are you a trading company or manufacturer?
A:
We are manufacturer.
Q:How long is your delivery time?
A:
Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is depends on quantity.
Q:Do you provide samples? Is it free or extra?
A:
No, we could not offer the machine sample for free charge but can provide free proofing for the customer.
Q:What materials can this machine process?
A:
It is mainly used for high speed thinning of precision parts of non-metallic and metal brittle and rigid materials such as silicon wafer, ceramics, glass, quartz crystal, sapphire and other semiconductor materials.
Q:What is the warranty period?
A:
The warranty period is 1 Year.
Send Inquiry
*To:Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.
Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.*Content:
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