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Semiconductor Silicon Wafer Grinding Machine Exporter
US$7,000.00
2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableWarranty
1-Year WarrantyType
Double Side Lapping MachineModel NO.
BWVoltage
380 VCNC or Not
CNCCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Specification
1700*1300*2170(mm)Trademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Machining: Equipment features high processing precision and stable operation for semiconductor silicon wafer grinding.
Fully Closed-Loop Control: Adopts PLC, grating ruler, and servo control for precise product thickness management.
Integrated Grinding Process: Thinning machine achieves integrated rough grinding and fine grinding in a single unit.
1-Year Warranty Coverage: Comprehensive 1-year warranty provided for all mechanical equipment.
CNC Technology: Equipped with CNC system for advanced automation and control capabilities.
Quality Inspection Reports: Machinery test reports and video outgoing inspections are provided for every unit.
Floor-Standing Installation: Designed for floor-standing installation method suitable for industrial environments.
High-Speed Grinding: Grinding wheel speed reaches up to 3000 Rpm for efficient processing.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤9.03h
AI-Powered supplier vetting
SummaryNanjing New Donor Machinery Equipment Co., Ltd., based in Jiangsu, China, is a manufacturer specializing in heat exchangers and related products. The company operates as a limited entity and is part of a larger company group. It provides OEM services for well-known brands but lacks SDK availability for R&D. The supplier exports a significant portion of its sales, mainly through agents. While it emphasizes quality and innovation, specific certifications are not detailed. It has a modern quality management system and offers versatile customization services.
Supplier typeThe supplier is a manufacturer/factory, operating as a limited company in Jiangsu, China, and is part of a larger company group.
Financial creditThe supplier's financial information is available for the last three years, indicating a stable financial capacity.
Production capacityThe supplier has advanced production equipment and a high-standard quality control system, suggesting strong production capabilities.
Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.
Client casesThe supplier has a good reputation among domestic and international customers, implying successful customer cases.
Product Q&A
Q:What is the warranty period for the machine?
A:
We provide a 1-year warranty for the semiconductor silicon wafer grinding machine.
Q:Does the machine support CNC control?
A:
Yes, the machine is equipped with CNC technology for precise operation.
Q:What is the maximum grinding wheel speed?
A:
The grinding wheel speed can reach up to 3000 Rpm.
Q:Is the machine suitable for floor installation?
A:
Yes, the equipment is designed with a floor-standing installation method.
Q:What core components does the machine use?
A:
The core components include PLC, grating ruler, and servo control systems.
Send Inquiry
*To:
Nanjing New Donor Machinery Equipment Co., Ltd.
Nanjing New Donor Machinery Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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