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Automatic Used Applied Materials Nokota™ Ecd China Semiconductor Electroplating System
US$320,000.00-800,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
24h OnlineFunction
High Temperature ResistanceModel NO.
Nokota ECDDemoulding
AutomaticCondition
UsedCertification
ISO, CEWarranty
3 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1 PCQuality
100% TestedAdaptation
Semiconductor Electroplating SystemInventory
AvailabilityTransport Package
Carton Box and Plastic BagSpecification
2800*2000*1800Trademark
Applied MaterialsOrigin
United StatesHS Code
8501520000Production Capacity
50000PCS/YearKey features
Designed for advanced packaging to support the manufacturing of various complex interconnect structures.
Compatible with various wafer sizes to meet diverse packaging process requirements.
Supports multiple metal plating, perfectly adapting to various advanced packaging solutions.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.54h
About Our Factory & Business Background
AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5
Our Production Capability & Technical Expertise
Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What products can you provide?
A:
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is your MOQ?
A:
Yes, the sample is available. Our Minimum Order Quantity (MOQ) is 1 piece.
Q:How long will it take to deliver the goods?
A:
About 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
We have besi,asm, disco, etc.
Q:What is the warranty of the machine?
A:
We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.
Send Inquiry
*To:
Guangdong Xinling Industrial Co., Ltd
Guangdong Xinling Industrial Co., Ltd*Content:
Supplier replies will be sent to your registered email
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