Advanced Automatic Molding System for High-Performance Semiconductor Manufacturing

Name: Advanced Automatic Molding System for High-Performance Semiconductor Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2120523175

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Demoulding

Pull Core

Model NO.

HM-0263

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

Auto Molding Equipment

Feature 1

Fully Automatic

Feature 2

CCD Image Detection

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Fully Automatic Operation: Advanced servo control with PLC and CCD image detection for high accuracy.

Rapid Mold Swap: Standardized mold structure designed for easy and quick replacement.

Flexible Expansion: Supports up to 4 sets of compressors to achieve high UPH.

Large Lead Frame Support: Accommodates lead frames up to 90mm x 300mm.

Visual System Identification: Identifies feeding direction automatically to prevent errors.

Imported Raw Materials: Ensures stable performance, high accuracy, and long service life.

OEM/ODM Services: Flexible customization options available for specific needs.

12 Months Warranty: Comprehensive coverage with 24-hour online technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.68h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.