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China Efficient Varian E500 Semiconductor Wafer Fab Equipment MID Beam Ion Implanter
US$85,000.00-128,000.00
1 set

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold

Model NO.

VARIAN E500

Demoulding

Automatic

Condition

Used

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

>1,000,000 Shots

Delivery

1-7 Days

MOQ

1 PC

Quality

100% Tested

Adaptation

Semiconductor Machine

Inventory

Availability

Transport Package

Carton Box and Plastic Bag

Specification

200*200*200

Trademark

VARIAN

Origin

China

HS Code

8479909090

Production Capacity

500PCS/Year

Key features

Precisely controls doping concentration and junction depth.
Achieves high-purity ion beam implantation.
Supports ultra-low and high-energy implantation.
Features extremely high beam current stability.
Supports 300-mm and 450-mm wafer processing.
Uses Faraday cup for real-time dose monitoring.

Company profile

Guangdong Xinling Industrial Co., Ltd
In-stock CapacityOEM ServicesOverseas ServicesSelf-branded
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.51h

About Our Factory & Business Background

AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5

Our Production Capability & Technical Expertise

Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:1. What products can you provide?
A:
We can provide Gelatinize machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines, oxidation/diffusion/annealing equipment, also known as heat treatment equipment
Q:2. The functions of the Gelatinize machine
A:
Pattern transfer: Just like a projector, the circuit patterns on the mask are projected onto the surface of a silicon wafer coated with photoresist through light. Microfabrication: Using ultraviolet light or extreme ultraviolet light, the photoresist undergoes a chemical reaction, and after development, fine nano-scale lines are etched onto the wafer.
Q:3. The principle of the Gelatinize machine
A:
The Gelatinize machine utilizes the principle of optical projection to shrink the circuit patterns and expose them onto the silicon wafer coated with photoresist. It is the core equipment in chip manufacturing. Its essence is to achieve precise transfer of nanoscale graphics through the use of light sources, masks, and precise optical systems.
Q:4. The application scope of the Gelatinize machine
A:
Display and Sensing: Electrode fabrication for flat panel displays (LCD/OLED), touchscreen sensors, and MEMS micro-electromechanical systems.
Q:5. What are the technical challenges of a Gelatinize machine?
A:
The precision of the Gelatinize machine is limited by the wavelength of the light source and the numerical aperture of the optical system. Furthermore, the EUV light source needs to generate plasma through laser bombardment of tin droplets, which is an extremely difficult technical challenge.

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